IBM · 5 days ago
Hardware Developer Engineer (Cable/Interconnect)
Houston, TX
Full-time
Onsite
New Grad, Entry Level
0+ years expIBM is a leading technology company focused on innovation and collaboration. They are seeking a Hardware Development Engineer to work on cutting-edge microprocessors and hardware, developing and supporting solutions that drive the quantum revolution and AI era.
Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
Responsibilities
Design, develop, and validate cable assemblies, harnesses, and interconnect solutions for IBM Tape Libraries
Collaborate with mechanical, electrical, and systems engineering teams to ensure proper routing, signal integrity, and compliance with EMC standards
Generate and manage documentation: wiring diagrams, cable drawings, specifications, and BOMs using tools such as Catia
Work with suppliers and manufacturing teams to ensure quality and manufacturability of cable components
Perform troubleshooting and root cause analysis for cable-related issues during prototyping and production
Ensure adherence to IBM’s hardware development processes and industry standards
Qualification
Required
A Bachelor's Degree in: Electrical Engineering, Computer Engineering, Computer Science, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Optics Engineering, Biomedical Engineering or related majors
Prior (project or internship) experience in computer hardware or testing
Strong verbal and written communication skills
Passion for technology and engineering
Growth minded, trusted, team focused, courageous, resourceful, and outcome focused
Preferred
Master's Degree
At least three months of computer or electrical engineering experience in cable assemblies, harnesses, and interconnectivity
Company
IBM
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
10001+ employees
H1B Sponsorship
IBM has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)
Funding
Current Stage
Public CompanyTotal Funding
unknown2011-01-14IPO
Leadership Team
Alain Bénichou
Chief Executive Officer, IBM Greater China Group
Alex Yang
CTO and Chief Architect
Recent News
2026-01-12
Company data provided by crunchbase