TE Connectivity · 1 day ago
STAFF R&D/PRODUCT DVL ENGINEER
TE Connectivity is dedicated to creating a safer, sustainable, and more connected world through innovative data communication solutions. As a Standards Engineer in the Digital Data Networks Business Unit, you will represent TE in global standards bodies, influence next-generation protocols, and ensure compliance with evolving specifications. This role involves building relationships with key technology individuals and translating complex specifications into actionable requirements for product development.
AutomotiveElectrical DistributionHardwareManufacturingSoftware
Responsibilities
Represent TE in consortia such as SNIA, INCITS, STA, PCI-SIG, CXL Consortium, IEEE 802.3, OCP, Ethernet Alliance, and InfiniBand Trade Association
Propose, draft, and defend technical contributions that advance TE’s strategic goals (e.g., connector footprints, channel definitions, thermal envelopes)
Build relationships with voting members, editors, peer interconnect suppliers, and working-group chairs to shape agendas and accelerate TE-favored specifications
Translate evolving spec language into detailed electrical, mechanical, and test requirements for TE’s product and R&D teams
Create gap analyses that highlight where TE must innovate to meet emerging compliance limits for speed, SI/PI, power, and thermals
Establish and maintain internal design guides, compliance matrices, and verification plans aligned to draft and ratified standards
Publish whitepapers, reference designs, and conference presentations that showcase TE’s standards insights and technical leadership
Organize internal workshops and training sessions to keep global teams current on draft revisions and upcoming ballots
Monitor competing proposals and market trends, recommending strategic positioning for TE’s next-gen interconnect technologies
Qualification
Required
Bachelor's degree in Electrical or Mechanical Engineering or a related field
8+ years of experience in compute, networking, AI, or storage system design and high-speed interconnect technologies
Knowledge of compute, AI/ML, networking, and storage architectures
Knowledge of hardware and associated signaling environments
Direct participation in at least one major body (SNIA, INCITS, STA, PCI-SIG, IEEE 802.3, CXL, OIF, or similar), including ballot review and contribution authorship
Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis)
Strong analytical and problem-solving skills, with experience in design trade-offs for power, latency, and scalability
Effective communicator, able to present technical concepts to internal teams, customers, and industry partners
Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies
Self-motivated with the ability to take the initiative to accomplish tasks with limited directions
Ability to spend 25%-50% of your time traveling to customers, conferences, and TE development sites
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Recent News
2025-11-14
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