Intel Corporation · 1 day ago
Packaging Module Development Engineer
Phoenix, AZ
Full-time
Onsite
New Grad, Entry Level
$85K/yr - $140K/yr
0+ years expIntel Corporation is seeking a Packaging Module Development Engineer to work on applications of machine vision and machine learning in semiconductor packaging manufacturing. The role involves project management, package design, and providing support for electronic packages, while also conducting tests and establishing material specifications.
Semiconductors
Responsibilities
Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units
Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages
Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design
Conducts tests and research on basic materials and properties
Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance
Provides consultation concerning packaging problems and improvements in the packaging process
Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment
Qualification
Required
Possess a Bachelor's degree in Engineering, Physics, or Computer Science or related field with 3+ months of experience
-OR- master's degree in engineering, Physics, or Computer Science or related field with 6+ months of experience
Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction
Preferred
Semiconductor Inspection (wafer, package, etc.)
Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems
Statistical principles, process control (SPC) and Design of Experiments (DOE)
Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes
Semiconductor devices and packing technology
Data science and statistics tools (Python is highly preferred)
Data management and visualization experience
Dimensional management for package features and planes
Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction
Machine Vision techniques, OpenCV experience and CNN Image Classification
Benefits
Competitive pay
Stock
Bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
Recent News
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