PHIZENIX ยท 3 days ago
Package Reliability Engineer
Santa Clara, California
Full-time
Onsite
Senior Level
$185K/yr - $225K/yr
5+ years expPhizenix is seeking an experienced Package Reliability Engineer with expertise in 2.5D/3D advanced packaging. The ideal candidate will collaborate with external assembly and test partners, as well as internal teams, to drive package reliability improvements and ensure the manufacturability of cutting-edge semiconductor packages.
Information Technology & Services
Responsibilities
Conduct physics of failure (PoF)-based reliability modeling for 2.5D/3D advanced packaging
Assess package reliability risks from thermal, mechanical, and electrical stressors
Define and execute stress test plans (e.g., thermal cycling, humidity, electromigration) to validate package robustness
Work closely with OSAT partners to drive package reliability improvements, process optimizations, and yield enhancements
Define reliability requirements, review test methodologies, and ensure OSAT compliance with JEDEC and industry standards
Monitor and evaluate OSAT performance in executing reliability qualifications and failure analysis
Support supplier audits and technical reviews to assess manufacturing capabilities and reliability processes
Evaluate and select materials (substrates, dielectrics, adhesives, underfills) for optimal reliability
Analyze CTE mismatches, warpage, delamination, and interfacial adhesion issues
Work with material suppliers and OSATs to qualify new materials for advanced packaging applications
Lead failure mode analysis (FMEA), model-based problem solving (MBPS) and determine root causes of package failures using techniques such as FIB, X-ray, SEM, and TEM
Identify and mitigate interfacial failures, cracking, voiding, electromigration, and stress-induced damage
Drive OSATs and internal teams to implement corrective and preventive actions (CAPA)
Work cross-functionally with internal design, process, and manufacturing teams to define assembly test vehicles and optimize package architectures
Develop and refine design guidelines, process improvements, and reliability best practices
Stay up to date with industry standards (JEDEC, IPC, IEEE, etc.) and implement best practices in package reliability
Qualification
Required
Master's or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or a related field
5-10 years of hands-on experience in 2.5D/3D advanced packaging reliability
Deep understanding of physics of failure (PoF) methodologies for package reliability
Strong knowledge of materials science, particularly in interconnects, substrates, and interfaces
Proficiency in stress modeling tools (ANSYS, Abaqus, COMSOL, etc.) for thermo-mechanical analysis
Experience with failure analysis techniques such as C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD
Proven track record of working with and driving OSAT partners for package reliability, yield, and continuous quality improvements
Experience managing OSAT qualifications, failure analysis, and corrective actions
Familiarity with supplier engagement, reliability testing at OSATs, and package process flows
Familiarity with JEDEC, IPC, IEEE, and MIL-STD reliability standards
Strong analytical, problem-solving, and cross-functional collaboration skills
Preferred
Experience in heterogeneous integration, fan-out packaging, chiplet architectures
Knowledge of electrical reliability mechanisms (e.g., electromigration, time-dependent dielectric breakdown)
Expertise in AI-driven reliability modeling or machine learning for failure prediction
Company
PHIZENIX
We provide Talent Solutions for the AI Era.
2-10 employees
Funding
Current Stage
Early StageCompany data provided by crunchbase