Microsoft · 1 day ago
Senior Physical Design Engineer
United States, Texas, Austin
Full-time
Hybrid
Mid, Senior Level
$120K/yr - $235K/yr
5+ years expMicrosoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is responsible for powering Microsoft’s Intelligent Cloud mission. They are seeking a Senior Physical Design Engineer to help define and deliver operational measures of success for hardware manufacturing and optimize the Cloud infrastructure.
Agentic AIApplication Performance ManagementArtificial Intelligence (AI)Business DevelopmentDevOpsInformation ServicesInformation TechnologyManagement Information SystemsNetwork SecuritySoftware
Responsibilities
Drive full‑chip physical verification integration, including roll‑ups, hierarchical checks, and signoff collateral generation
Perform LVS, DRC, ERC, Antenna, density, and reliability rule checks across block, subsystem, and top level
Coordinate with CAD, RTL/Design teams/DFT, Architecture team, Foundry interface team, Technology team & other internal/external partners as essential
Help influence design tools, flows, and methodologies in construction and signoff through a data-driven approach
Contribute to floor-planning, power grid and design planning activities for correct by construction integration
Drive physical verification signoff for tape out across multiple advanced technology nodes
Foster collaboration across teams to deliver the best possible solutions, aligned with a One Microsoft mindset
Demonstrate technical expertise across various domains of Physical Design Verification
Clear communications on project status & planning
Demonstrate Microsoft core values: Customer Focus, Adaptability, Collaboration, Growth Mindset, Drive for Results, Influence for Impact, Judgement, and Diversity & Inclusion
Qualification
Required
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
Preferred
BS/MS in Electrical or Computer Engineering or any related degree
8+ years of experience in semiconductor design
Effective communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams
Experience in Physical Design domain implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification
Experience in hierarchical design work, Design Planning and integration with multiple production tape-outs using advanced foundry process nodes
Demonstrate technical expertise in all aspects of Physical Design Verification including but not limited to DRC, LVS, Antenna analysis, PERC, ERC and ESD analysis
Own complete physical verification and sign off of Critical blocks/Partitions/Sub-systems/Sub-chips instantiating/integrating multiple other Physical partitions. Be fully hands-on in your individual ownerships as individual contributor and collaborate cross-team as required
Proficient in integration activities and methodology with hands-on experience
Working understanding of PERC and ESD analysis, RDL implementation and bump planning
Knowledge of RTL to GDS implementation in Physical Design domain
Hands-on experience with performing LVS, DRC, ERC, Antenna, density, and reliability rule checks across block, subsystem, and top level
Partner closely with PD flow/CAD team and PD methodology team to flag & fix PD TFM issues upfront and ensure those are fixed in the next PD TFM release from CAD or are updated in the design project layer (as appropriate)
Skilled in industry-standard EDA tools for physical verification (Calibre or ICV) and working knowledge of tools like Fusion or Innovus for place and route implementation
Mentor junior engineers on technical aspects
Advanced proficiency in Engineering Change Order (ECO) implementation for layout convergence, with solid knowledge of physical design ECO closure methodologies
Demonstrated ownership of deliverables and strong cross-functional teamwork
Experience in mentoring, influencing teams, and driving alignment through clear and effective communication
Good analytical and problem-solving skills, complemented by advanced scripting capabilities in Perl, TCL, and Python
Company
Microsoft
Microsoft is a software corporation that develops, manufactures, licenses, supports, and sells a range of software products and services.
10001+ employees
H1B Sponsorship
Microsoft has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
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Funding
Current Stage
Public CompanyTotal Funding
$1MKey Investors
Technology Venture Investors
2022-12-09Post Ipo Equity
1986-03-13IPO
1981-09-01Series Unknown· $1M
Leadership Team
Satya Nadella
Chairman and CEO
Vukani Mngxati
Chief Executive Officer - Microsft South Africa
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