NXP Semiconductors · 1 day ago
Senior Cleans Process Engineer
NXP Semiconductors is a leader in manufacturing high-quality semiconductor devices. The Cleans Process Engineer will develop and optimize cleans processes in a high-volume semiconductor wafer manufacturing environment, ensuring material quality and process stability.
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Responsibilities
Develop and optimize cleans processes for silicon semiconductors
Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems
Analyze metrology data to monitor material quality and drive improvements
Reduce defectivity mechanisms and improve process control
Lead troubleshooting and root cause analysis for process deviations and yield issues
Participate in and/or lead cross-functional and lean activity teams
Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities
Drive equipment performance to maximize capacity and yield performance
Improve cost performance of equipment
Mentor engineers and provide technical leadership in Cleans process improvement
Qualification
Required
Must have a B.S. Degree in Chemical, Electrical, or Mechanical Engineering, Materials Science, Solid State Physics or other relevant engineering discipline is required
Minimum 10 years' experience in Cleans process engineering in a high-volume semiconductor manufacturing environment
Strong background in SPC & FDC is required
Positive interpersonal skills, highly energetic and self-motivated
Outstanding written and verbal communication skills
Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs
Demonstrated application of structured problem solving methodology along with creative thinking to drive to failure root cause
Demonstrated ability to meet commitments and deliver results
Demonstrated experience with Design of Experiments
Demonstrated experience with automated fault detection and control systems
General understanding of equipment component behavior
Preferred
Experience with LAM Davinci Backside Etch, LAM Novellus Plate, Akrion hoods, and Screen hoods or similar style wet etch platforms is highly desirable
Company
NXP Semiconductors
NXP Semiconductors produces secure connectivity solutions for embedded applications.
Funding
Current Stage
Public CompanyTotal Funding
$2.56BKey Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO
Recent News
GlobeNewswire
2026-01-07
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