Integra Technologies Inc. · 1 day ago
Senior Process Engineer
Milpitas, CA, US
Full-time
Onsite
Senior Level, Lead/Staff
$100K/yr - $135K/yr
10+ years expIntegra Technologies Inc. is a company focused on enhancing production processes in the semiconductor industry. The Senior Process Engineer will be responsible for IC Assembly process development and improvement to increase efficiency and quality on the production floor through documentation, training, and experiments.
3D PrintingComputerInformation TechnologyManufacturing
No H1B
U.S. Citizen Only
Responsibilities
Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements
Daily interaction directly with customers with regard to technical issues and specification reviews
Manage and define Assembly Processes relating to specific Products and/or Customers
Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity
Provide DOE, SPC, and yield reporting in a clear and presentable format
Collect Assembly yield data and perform yield analysis for production equipment and customer products
Generate detailed reports and specifications documenting all experimental and process findings and procedures
Assess existing processes and identify areas of improvement and solutions for these systems
Evaluate and provide recommendations on new equipment that will enhance the current production capabilities
Conduct root cause analysis and corrective actions related to process failures
Identify and implement cost, quality, and yield improvements
Flexible to perform other duties as assigned
Qualification
Required
Bachelor's Degree in Engineering, Electrical, Mechanical, Material Science, or related field
Hands-on Experience in Semiconductor Back End Process Engineering
Must be a United States Citizen in order to work on sensitive military and aerospace programs
Preferred
Advanced understanding of Semiconductor processes
Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding
10 years of Assembly Process Engineering experience
Hands on in Die Attach, Wire Bond or Mold
Knowledge of basic AutoCAD or Solidworks
Statistical Process Control, Design of Experiments & FMEA experience
Detail-oriented, data entry accuracy, problem solver, good analytical skills, team player, multitask capability
General computer skills, including Microsoft Office Suite
Strong written and verbal communication skills
Company
Integra Technologies Inc.
Our mission: to deliver secure, reliable, state-of-the-art semiconductors and semiconductor services with unwavering integrity.
201-500 employees
Funding
Current Stage
Growth StageTotal Funding
unknown2025-01-15Acquired
Leadership Team
Ted Tessier
Chief Technology Officer - Advanced Packaging Technologies
Dave Bass
Chief Technical Officer / VP of Engineering
Recent News
2025-04-21
Wichita Business Journal
2025-01-28
2025-01-23
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