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Alloy Enterprises Inc · 1 day ago

Co-Op, Materials Process Engineer, Fall 2026 (July - December)

Burlington, MA

Full-time

Onsite

New Grad

$23/hr - $28/hr

Alloy Enterprises Inc is a hardtech startup focused on improving heat dissipation in high-performance systems through novel complex metal components. They are seeking a Material Process Engineering co-op to help develop and standardize processes for a new feedstock material, emphasizing strong communication and adaptability.

IndustrialIndustrial EngineeringManufacturing

No H1B

Responsibilities

Tune process parameters to make performance improvements

Assist in quality control and process improvement efforts for production scale-up

Develop and perform surface characterization testing and metallographic inspection

Perform electron and optical microscopy analysis

Support feedstock alloy development and validation

Develop and perform mechanical testing methods

Design and carry out Design of Experiments and other statistical analysis

Use Alloy’s hardware and software to build sample parts and test specimens

Provide feedback to mechanical and software engineers on machine performance

Develop automated data collection, statistical analysis, and reporting on quality metrics

Qualification

Materials scienceMechanical engineeringStatistical analysisPythonLinuxExcelJiraGitPLC programmingCommunicationAdaptability

Required

You take ownership of your projects, completing tasks efficiently and effectively

You are adaptable and excel when working in a fast-paced environment

Pursuing a degree in Mechanical Engineering, Manufacturing, Materials, or Chemistry

Strong communication skills and ability to document technical

Preferred

Background or coursework in materials science, mechanical engineering, or controls preferred

Past industry co-ops or internships strongly desired

Basic SW experience is a plus: Python, linux, excel, Jira, git, or PLC programming

Company

Alloy Enterprises Inc

Alloy Enterprises manufactures direct liquid-cooled components that handle extreme heat loads in AI, high-performance computing, defense electronics, and photonics.

Founded in 2020