Software Architect - Power and Thermal Management for Server SoCs, Principal jobs in United States
cer-icon
Apply on Employer Site
company-logo

Qualcomm · 3 days ago

Software Architect - Power and Thermal Management for Server SoCs, Principal

Qualcomm Technologies, Inc. is seeking talented and innovative software engineers to define the architecture for low level software and firmware on server SoCs. The role involves collaborating with systems engineers and hardware architects to design a high-performance software stack for power and thermal management solutions.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Collaborate with engineers from a variety of disciplines (systems, hardware, software, etc.) to define and document the power, thermal, and limits management architecture for server SoCs
Represent the interests of software teams in architecture discussions to arrive at the right trade-offs in the architecture, e.g. between hardware complexity vs. software complexity, or unit cost vs. tuning effort
Define and document the software partitioning across the various CPUs and microcontrollers in the system; and define and manage APIs to support this partitioning
Drive the process of converting the system level power, thermal, and limits management architecture into a software design and software requirements that can guide the software development teams
Work with software teams to provide guidance on the architecture and design, to help resolve issues, and to support optimization and tuning activities

Qualification

CC++JavaPythonPower managementThermal managementLimits managementEmbedded systemsModern operating systemsARM64 architectureSoftware development methodologiesIn-lab debugging toolsAnalytical skillsCommunication skillsCollaboration skills

Required

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Software Engineering or related work experience
Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Software Engineering or related work experience
PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Engineering or related work experience
3+ years of work experience with Programming Language such as C, C++, Java, Python, etc

Preferred

15+ years of experience in designing software and firmware for embedded or datacenter environments
Experience in power, thermal and limits management at the system level or device driver level
Strong expertise in modern operating systems, ARM64 architectures, and software development methodologies
Familiarity with software standards for power and thermal management such as SCMI, PSCI, SystemReady, ACPI, and device tree
Practical experience with in-lab debugging tools
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 12+ years of Software Engineering or related work experience
Master's degree in Engineering, Information Systems, Computer Science, or related field and 10+ years of Software Engineering or related work experience
PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Software Engineering or related work experience
8+ years of work experience with Programming Language such as C, C++, Java, Python, etc
Strong analytical skills and the ability to approach problems at a system level
Strong communication skills and ability to collaborate across engineering disciplines

Benefits

Competitive annual discretionary bonus program
Annual RSU grants
Highly competitive benefits package

Company

Qualcomm

company-logo
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

leader-logo
Cristiano Amon
President and Chief Executive Officer
linkedin
I
Isaac Eteminan
CEO
linkedin
Company data provided by crunchbase