Package Design Engineer jobs in United States
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NVIDIA · 1 day ago

Package Design Engineer

NVIDIA is a leader in GPUs and SOCs, seeking a passionate Senior Package Design Engineer to contribute to innovative solutions. The role involves leading package test vehicle designs and collaborating with cross-functional teams to enhance package technologies in NVIDIA products.

AI InfrastructureArtificial Intelligence (AI)Consumer ElectronicsFoundational AIGPUHardwareSoftwareVirtual Reality
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Your responsibilities will include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles
The focus will be primarily on flip chip and 2.5D interposer based packages
Implement electrical/mechanical/thermal structures in test vehicles for effective package technology evaluations
Develop design flow for new package technologies
Collaborate with cross functional teams to incorporate various requirements in package designs
Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules

Qualification

Package design experienceCadence Allegro Packaging DesignProgramming skills2.5D package experienceProblem solving skills

Required

BS in EE or ME (or equivalent experience)
3+ years package design experience
Strong programming skills (Perl, Python, Tcl desired)
Working knowledge of Cadence Allegro Packaging Design (APD)
Experience in 2.5D packages
Strong problem solving skills

Benefits

Equity
Benefits

Company

NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.

H1B Sponsorship

NVIDIA has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1877)
2024 (1355)
2023 (976)
2022 (835)
2021 (601)
2020 (529)

Funding

Current Stage
Public Company
Total Funding
$4.09B
Key Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity

Leadership Team

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Jensen Huang
Founder and CEO
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Michael Kagan
Chief Technology Officer
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Company data provided by crunchbase