Hewlett Packard Enterprise · 1 day ago
Principal Hardware Engineer
Sunnyvale, California, United States of America
Full-time
Hybrid
Lead/Staff
$154K/yr - $310K/yr
10+ years expHewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. They are seeking a Principal Hardware Engineer to work collaboratively with various engineering teams to develop high-end routing platforms, from concept to mass production and customer support.
Data CenterEnterprise SoftwareInformation TechnologyIT ManagementNetwork Security
Responsibilities
Participate in product feasibility and definition
Specifications, schematics, BOMs, prototype lab bring-up and maintenance, hardware test plans and reports
Serve as technical lead and collaborate with the following hardware engineering teams: signal integrity, power, thermal, PCB design, mechanical, DFM/DFT, lab technicians
Review/approve test reports and support the following: EDVT, MDVT, NEBs, HALT, Safety, EMC teams
Participate in defining diagnostics tests for manufacturing and development
Training and support of manufacturing, customer support and sustaining teams
Collaborate with technical publications team, software, test and diagnostics engineering
Work with program manager and engineering lead to provide project status
Work with component engineering and commodity managers on external component selection and qualification
Interface with external component suppliers on implementation and debug
Mentor and review the work of junior hardware engineers
Flexible hours to accommodate collaboration with engineering teams across geographies
Qualification
Required
BS, MS in Electrical Engineering or Computer Engineering
10+ years of experience with board design and/or FPGA design
Expert level proficiency in electrical circuit and schematic design, including experience with embedded CPU and SoC subsystems
Deep knowledge of systems design considerations from many angles including software, firmware, BIOS, PCB layout, signal integrity, mechanical, thermal, power, EMI compliance, manufacturability, testability, MTBF and COGS
Proficient in advanced design techniques for multiple-layer, high speed printed circuit boards
Experience with design and debug of PCIe, Ethernet, I2C, clocks, high speed SerDes and high speed memory interfaces
Hands-on experience and strong debugging proficiency using lab measurement equipment such as high speed oscilloscopes, protocol analyzers and VNAs
Experience with FPGA design and operation. Proficiency with Verilog programming, FPGA simulation and FPGA synthesis process
Experience in a Unix/Linux environment
Preferred
Experience designing network routers and switches to high volume quantities with outstanding production quality
Understanding of core routing, edge routing, switching, forwarding, switch fabrics, WAN interfaces, pluggable optics (QSFP-DD, OSFP), campus and data center customer network design, testing, deployment and troubleshooting
Hands-on experience testing complex L2/L3 products with Ethernet packet generators such as Ixia or Spirent
Industry experience using Cadence Allegro PCB Designer layout tool and ePD/Viewlogic schematic capture tool
Python, Perl or TCL programming skills; scripting and test automation experience
Benefits
Health & Wellbeing
Personal & Professional Development
Unconditional Inclusion
Company
Hewlett Packard Enterprise
Hewlett Packard Enterprise is an edge-to-cloud company that uses comprehensive solutions to accelerate business outcomes.
10001+ employees
H1B Sponsorship
Hewlett Packard Enterprise has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (532)
2024 (585)
2023 (591)
2022 (523)
2021 (551)
2020 (398)
Funding
Current Stage
Public CompanyTotal Funding
$2.85BKey Investors
Elliott Management Corp.
2025-04-15Post Ipo Equity· $1.5B
2024-09-10Post Ipo Equity· $1.35B
2015-11-02IPO
Leadership Team
Fidelma Russo
EVP & GM, Hybrid Cloud and Chief Technology Officer
Marie Myers
Chief Financial Officer
Recent News
2026-01-09
The Register
2026-01-06
Company data provided by crunchbase