GlobalFoundries · 18 hours ago
MTS Packaging Integration Engineer
Malta, NY
Full-time
Onsite
Mid, Senior Level
$94K/yr - $175K/yr
4+ years expGlobalFoundries is a leading full-service semiconductor foundry providing design, development, and fabrication services. The MTS Packaging Integration Engineer role focuses on delivering advanced packaging solutions and ensuring product reliability while driving innovations in the assembly of photonic and electronic packages.
ElectronicsManufacturingSemiconductor
Responsibilities
Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets
Establishment of manufacturing driven design rules
Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts
Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems
Provides tools and complex analysis of quality issues and associated financial implications
Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs
Ensures standardization of site-based quality processes are executed appropriately
Drives discipline and qualification robustness through a consistent global qualification process
Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
Perform project management and data analysis
Identify and resolve process integration issues and related problems
Develop custom or derivative processes to meet customer needs
Support new designs with module characterization and design rule development
Work with cross function teams to resolve technical & yield concerns
Develop and improve test structures that enable fast and rigorous characterization of process
Drive CIP (Continuous improvement plans) to deliver organizational goals
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Qualification
Required
MS, or PhD + 4 or more years of experience
Extensive experience with failure analysis, design of experiments, & packaging process integration
Experience in bringing packaged products from development into production
Strong written and spoken English communication skills
Preferred
Materials science, thermal, mechanical, simulation background
Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem
Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging
Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing
Company
GlobalFoundries
GlobalFoundries is a full-service semiconductor foundry that manufactures integrated circuits in high volume.
10001+ employees
H1B Sponsorship
GlobalFoundries has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (114)
2024 (76)
2023 (66)
2022 (100)
2021 (87)
2020 (187)
Funding
Current Stage
Public CompanyTotal Funding
$4.39BKey Investors
European CommissionU.S. Department of CommerceU.S. Department of Defense
2025-12-11Grant· $579.33M
2024-11-20Grant· $1.5B
2024-05-22Post Ipo Secondary· $750M
Leadership Team
D
DK Sohn
VP
Jonathan Park
IP Strategy and Offering Management
Recent News
2026-01-03
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2026-01-03
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