Marvell Technology · 3 days ago
Package Development, Signal Integrity and Power Integrity Engineer, Staff
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
$107K/yr - $158K/yr
5+ years expMarvell Technology is a leading company in semiconductor solutions, focusing on data infrastructure across various architectures. They are seeking a High-speed IC package development engineer to contribute to the development of advanced microelectronic packages, ensuring performance, reliability, and manufacturability while collaborating with cross-functional teams.
DSPInternet of ThingsManufacturingSemiconductorWireless
Responsibilities
Package development
Electrical design
Modeling
Characterization
Interface with package suppliers
Select package technology
Drive layout
Ensure manufacturability
Compliance with performance, reliability, and cost requirements
Interface with marketing and IC designers to develop achievable package specs
Contribute to new package technology development
Qualification
Required
Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master's/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience
Strong fundamentals in EM, transmission lines and microwave theory
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing
Familiarity with IC package layout tools like APD or PADS
Ability to automate the SI, PI and Packaging activities using scripting tools like Python
Working knowledge of circuit design tools: Spectre, ADS, HSpice
Experience with VNA and TDR measurements for package and PCB characterization
Frequency domain and time domain knowledge of high speed signaling
Experience with high-speed electronic packaging for digital and analog ICs
Power plane design, modeling and analysis using tools like PowerSI, SIwave
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Understanding, debugging and simulations of EMI/EMC problems
A team player
Strong communication, presentation, and documentation skills
Preferred
Experience with 2.5D/3D package development is highly desired
Track record of new product introduction from concept, through development and production is a plus
Knowledge of the thermal and mechanical analysis of the IC package development is a plus
Experience with channel simulations using MATLAB or ADS or other tools is a plus
Benefits
Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
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