2026 Graduate Packaging Design Co-Op/Intern jobs in United States
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AMD · 3 weeks ago

2026 Graduate Packaging Design Co-Op/Intern

AMD is a leading company focused on building innovative products that enhance computing experiences across various domains. They are seeking a highly motivated PhD Packaging Design intern/co-op to participate in the research and development of next-generation product differentiation features, working closely with experts in the field.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Use Cadence tools for design, modeling and simulations
Use analytical and simulation tools to define package/module design requirements in the project conception stages. Conduct routing, stack-up & component placement studies in addition to completing the package design activities
Develop multi-signal package/module models over 50 GHz bandwidth and suitable test structures for model to measurement correlation
Performing Power Integrity analysis for core as well as IO and generate power delivery network requirements with emphasis on model to measurement correlation
Develop scripts for checking package parameters across device families, maintain a database of electrical design guidelines and rules for IO and PDN package layout implementations

Qualification

Cadence toolsPower Integrity analysis2D/3D package designVLSI knowledgeCommunication skills

Required

Graduate Candidates in Engineering (Electrical, Mechanical)
Courses in VLSI, EM, packaging
The ability to understand electrical requirements and apply principles learnt in their course work
Good communication skills and ability to work with a senior engineer

Preferred

Current working Knowledge of Cadence package design tool is a plus
Working knowledge of 2D/3D package design and modeling tools, such as Cadence, Ansys, AutoCAD etc. is a plus
Knowledge on DoE, DFM/DFR is a plus

Benefits

AMD benefits at a glance.

Company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

H1B Sponsorship

AMD has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (836)
2024 (770)
2023 (551)
2022 (739)
2021 (519)
2020 (547)

Funding

Current Stage
Public Company
Total Funding
unknown
Key Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity

Leadership Team

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Lisa Su
Chair & CEO
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Mark Papermaster
CTO and EVP
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Company data provided by crunchbase