AMD · 1 day ago
2026 PhD PhD Packaging Design Co-Op/Intern
AMD is a leading company in next-generation computing experiences, focusing on innovation and collaboration. They are seeking a highly motivated PhD Packaging Design intern/co-op to participate in research and development of product differentiation features, working alongside ML/AI engineers and gaining real-world experience in package design.
AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
Responsibilities
Use Cadence tools for design, modeling and simulations
Use analytical and simulation tools to define package/module design requirements in the project conception stages. Conduct routing, stack-up & component placement studies in addition to completing the package design activities
Develop multi-signal package/module models over 50 GHz bandwidth and suitable test structures for model to measurement correlation
Performing Power Integrity analysis for core as well as IO and generate power delivery network requirements with emphasis on model to measurement correlation
Develop scripts for checking package parameters across device families, maintain a database of electrical design guidelines and rules for IO and PDN package layout implementations
Qualification
Required
Ph.D. Candidates in Engineering (Electrical, Mechanical)
Courses in VLSI, EM, packaging
Ability to understand electrical requirements and apply principles learnt in their course work
Good communication skills
Ability to work with a senior engineer
Preferred
Current working Knowledge of Cadence package design tool
Working knowledge of 2D/3D package design and modeling tools, such as Cadence, Ansys, AutoCAD etc
Knowledge on DoE, DFM/DFR
Benefits
AMD benefits at a glance.
Company
AMD
Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.
H1B Sponsorship
AMD has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (836)
2024 (770)
2023 (551)
2022 (739)
2021 (519)
2020 (547)
Funding
Current Stage
Public CompanyTotal Funding
unknownKey Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity
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