Semiconductor Maintenance Technician – Subfab Support jobs in United States
cer-icon
Apply on Employer Site
company-logo

NXP Semiconductors · 1 day ago

Semiconductor Maintenance Technician – Subfab Support

NXP Semiconductors is a leading semiconductor company, and they are seeking a Semiconductor Maintenance Technician for their Subfab Support team. The role involves providing technical expertise and performing maintenance tasks in the Chandler Subfab area, ensuring the reliability and performance of various toolsets.

AppsAutomotiveEnergy EfficiencyInformation TechnologyManufacturingMobileNewsSemiconductorSoftwareVideo

Responsibilities

Providing technical expertise and day-to-day work direction for the Chandler Fab Subfab team
Performing scheduled and unscheduled maintenance in Chandler Subfab and support equipment areas
Effectively executing tasks that are required to maintain the toolsets for several Fab functional areas (Photo, Etch, CVD, Metals, Diffusion, Implant, etc.)
Lower Support Module Parts Cleaning
Abatement equipment
Chillers and Heat Exchanger repair/replacement
RF & Microwave generator maintenance
Vacuum pump support (temperature control systems, foreline leaks and clogs, general pump inspection and replacement assistance)
Troubleshooting and repair of electrical and electronic systems, pneumatic, vacuum, and mechanical systems
Scheduled maintenance, consumable changes, and various other activities relevant to the success of the subfab area
Interface with other internal and external groups to ensure all safety, performance, and reliability requirements are satisfied
Complete documentation and train others
Effectively communicate using written and verbal skills
Stand for long periods of time (up to 12 hours)
Physically able to perform required tasks which may include stooping, crawling in confined spaces, and lift/carry objects up to 50 pounds

Qualification

Semiconductor maintenanceTroubleshooting electrical systemsTroubleshooting mechanical systemsTechnical diagram readingDiagnostic test equipmentProblem solvingCommunication skills

Required

The candidate(s) selected will be responsible for providing technical expertise and day-to-day work direction for the Chandler Fab Subfab team
Performing scheduled and unscheduled maintenance in Chandler Subfab and support equipment areas
Effectively executing tasks that are required to maintain the toolsets for several Fab functional areas (Photo, Etch, CVD, Metals, Diffusion, Implant, etc.)
Troubleshooting and repair of electrical and electronic systems, pneumatic, vacuum, and mechanical systems
Scheduled maintenance, consumable changes, and various other activities relevant to the success of the subfab area
Solid understanding of SPC, 5s, FDC systems, and demonstrate problem solving skills
Ability to interface with other internal and external groups to ensure all safety, performance, and reliability requirements are satisfied
Complete documentation and train others
Effectively communicate using written and verbal skills
Stand for long periods of time (up to 12 hours)
Physically able to perform required tasks which may include stooping, crawling in confined spaces, and lift/carry objects up to 50 pounds
Working compressed shifts, job openings on either days or nights may be available
Specific knowledge of semiconductor maintenance job functions is required

Preferred

AA, AS, AAS, in electronics, chemistry, mechanical, or industrial engineering related discipline is preferred
Education along with experience or military training may satisfy formal education requirements
Proficiency in troubleshooting mechanical, electrical, and control systems
Ability to read and understand technical diagrams and drawings
Use of diagnostic test equipment (e.g. digital multimeters, anemometers, oscilloscopes, etc.)

Company

NXP Semiconductors

company-logo
NXP Semiconductors produces secure connectivity solutions for embedded applications.

Funding

Current Stage
Public Company
Total Funding
$2.56B
Key Investors
European Investment Bank
2025-08-12Post Ipo Debt· $1.5B
2025-01-15Post Ipo Debt· $1.06B
2010-08-06IPO

Leadership Team

leader-logo
Bill Betz
Chief Financial Officer
linkedin
leader-logo
Jeff Miles
VP Global Business Development Secure IOT and Cloud
linkedin
Company data provided by crunchbase