Intel Corporation · 11 hours ago
Packaging Module Development Engineer
Phoenix, AZ
Full-time
Onsite
New Grad, Entry Level
$134K/yr - $189K/yr
0+ years expIntel Corporation is a leader in semiconductor manufacturing, striving to deliver innovative technology for the AI era. The Packaging Module Development Engineer will develop assembly processes and equipment, optimize manufacturing efficiency, and ensure quality and reliability in packaging technologies.
Semiconductors
Responsibilities
Develops assembly processes and/or equipment and apply novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversee the cycle of manufactured package processes, procedures and flows
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones
Qualification
Required
Education: Master's (6+ months) --or-- PhD (1+ yr) of experience
Relevant Experience Must Include The Following: Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction
Preferred
Masters (6+ months) --or-- PhD (1+ yr) of experience in one or more of the following:
Semiconductor Inspection (wafer, package, etc.)
Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems
Statistical principles, process control (SPC) and Design of Experiments (DOE)
Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes
Semiconductor devices and packing technology
Data science and statistics tools (Python is highly preferred). Data management and visualization experience
Dimensional management for package features and planes
Machine Vision techniques, OpenCV experience and CNN Image Classification
Benefits
Health
Retirement
Vacation
Competitive pay
Stock
Bonuses
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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