Principal DRAM Architect – GPU Memory Solutions jobs in United States
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NVIDIA · 2 days ago

Principal DRAM Architect – GPU Memory Solutions

positionSanta Clara, CA
timeFull-time
remoteOnsite
seniorityLead/Staff
money$272K/yr - $431K/yr
date15+ years exp

NVIDIA is seeking a world-class Principal DRAM Architect to define, drive, and deliver the architecture, roadmap, and implementation of next-generation AI and graphics memory solutions. This role involves architecting next-generation DRAM solutions, leading innovation in high-speed memory interfaces, and collaborating with DRAM vendors to influence global memory standards.

AI InfrastructureArtificial Intelligence (AI)Consumer ElectronicsFoundational AIGPUHardwareSoftwareVirtual Reality
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Growth Opportunities
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H1B Sponsor Likelynote
Hiring Manager
Devin Constant
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Responsibilities

Architect next-generation DRAM solutions and NVIDIA-specific implementations — including bank and stack structures, refresh mechanisms, retention schemes, ECC/CRC, power management, and reliability optimization
Lead innovation in high-speed memory interfaces, with deep expertise in HBM PHYs (wide I/O, TSV signaling, SI/PI, timing margins) and an understanding of GDDR/LPDDR PHY architectures
Collaborate across domains on advanced packaging technologies (TSVs, interposers, CoWoS, hybrid bonding, FOWLP) to optimize DRAM–GPU co-packaging for bandwidth, power, thermal performance, and yield
Evaluate emerging DRAM process nodes (sub-1x nm, EUV, new capacitor/dielectric materials) and their impact on density, power, retention, and cost
Influence industry direction by working with DRAM vendors and actively contributing to JEDEC committees, driving next-generation memory standards and NVIDIA-specific roadmap alignment
Model and quantify system-level trade-offs in bandwidth, latency, power, cost, yield, and thermal behavior to guide architectural decisions
Mentor engineers, lead technical reviews, and shape NVIDIA’s long-term memory architecture vision

Qualification

DRAM architectureHBM expertiseI/O design fundamentalsJEDEC participationAdvanced packaging technologiesSystem-level trade-offsThermal managementCross-functional communicationMentoring engineersTechnical leadership

Required

MS or PhD in Electrical Engineering, Computer Engineering, Physics (or equivalent experience)
15+ years of experience in DRAM or memory system architecture, with at least 5+ years focused on HBM (HBM2/2e/3/3e or next-gen)
Expertise in HBM architecture: TSV design, die stacking, interposer/CoWoS integration, refresh schemes, ECC/CRC, pseudo-channels, and thermal/power management
Proven participation in JEDEC or equivalent standards organizations, contributing to DRAM or HBM specifications
Demonstrated ability to influence DRAM vendor roadmaps, negotiate trade-offs, and enable early silicon validation
Strong understanding of I/O and PHY design fundamentals — timing, SI/PI, equalization, jitter budgeting
Proven experience balancing system-level trade-offs across performance, bandwidth, power, cost, yield, and reliability
Exceptional technical leadership and cross-functional communication skills

Preferred

Hands-on experience with GDDR6/7 and LPDDR5/6 architectures — including bank management, signaling, power states, and error handling
Deep understanding of thermal and mechanical challenges in advanced memory packaging and 3D integration
Familiarity with emerging memory technologies (3D DRAM, MRAM, RRAM, or next-gen hybrid memory)
Publications, patents, or JEDEC leadership roles demonstrating influence on memory architecture and standards
Background in high-bandwidth computing platforms — AI, HPC, or graphics accelerators

Benefits

Equity
Benefits

Company

NVIDIA

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NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
dateFounded in 1993
location
Santa Clara, California, USA
people-size10001+ employees
web-link
https://www.nvidia.com

H1B Sponsorship

NVIDIA has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1877)
2024 (1355)
2023 (976)
2022 (835)
2021 (601)
2020 (529)

Funding

Current Stage
Public Company
Total Funding
$4.09B
Key Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity

Leadership Team

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Jensen Huang
Founder and CEO
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Michael Kagan
Chief Technology Officer
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Company data provided by crunchbase