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Eurofins Viracor BioPharma Services · 1 day ago

Engineer, DPA (Destructive Physical Analysis) | EAG Laboratories

Irvine, CA

Full-time

Onsite

Senior Level

5+ years exp

Eurofins Viracor BioPharma Services is part of Eurofins Scientific, a global leader in analytical testing. The DPA Engineer will lead advanced analysis on electronic devices, ensuring compliance with industry standards and providing technical guidance to team members.

Biotechnology

No H1B

U.S. Citizen Only

Responsibilities

Lead Destructive Physical Analysis (DPA) investigations per MIL-STD methods (e.g., MIL-STD-883, MIL-STD-750, MIL-STD-1580) to identify defects and assess reliability risks

Perform advanced analysis using optical/digital microscopy, SEM/EDS, X-ray (2D/real-time), and C-SAM to characterize component construction and detect anomalies

Conduct cross-sectioning, de-lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques

Design and implement test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams

Develop and standardize new techniques and bring new tools online to enhance lab capabilities

Analyze sub-micron level features to identify failure initiation sites and construction anomalies

Generate detailed technical reports and present findings to internal teams and customers

Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications

Provide technical guidance to technicians and junior engineers; mentor team members on best practices

Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements

Protect confidential information and proprietary processes

Qualification

DPA techniquesFailure analysisMIL-STD methodsLab equipment proficiencyDevice physics knowledgeAnalytical skillsProblem-solving skillsTechnical reportingCommunication skills

Required

U.S. Citizen

U.S. Permanent Resident (i.e. “Green Card Holder”)

Political Asylee or Refugee

5+ years of relevant experience in failure analysis, semiconductor packaging, or electronics reliability

Expertise in FA techniques and firsthand experience with DPA and related methods

Familiarity with MIL-STD test methods and industry standards (ISO, JEDEC, AEC, IPC)

Proficiency with lab equipment and software tools (MS Office, LabView, GDS layout)

Knowledge of device physics, IC design, and electronics failure analysis methodology

Strong analytical and problem-solving skills; ability to work independently and multi-task

Excellent written and verbal communication skills for technical reporting and collaboration

Ability to continuously operate a personal computer or lab equipment for extended periods (4+ hours)

Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead

Must be able to remain in a stationary position 80% of the time

Ability to communicate clearly and understandably in normal conversational distance, over the telephone, and in group settings

Ability to handle small and fragile devices with tweezers and/or fingers

Require close-distance visual acuity with or without correction (glasses, contacts, etc.)

Must be willing and able to wear PPE such as respirator, hard-hat, steel-toed shoes, safety glasses, laboratory coat, and other required devices or equipment

Ability to learn new tasks, remember processes, maintain focus, complete tasks independently, and make timely decisions in workflow contexts

Ability to move equipment or items up to 50 lbs