Samtec Inc · 2 months ago
Principal Optoelectronic Packaging Engineer
San Diego, CA
Full-time
Onsite
Lead/Staff
$187K/yr - $212K/yr
15+ years expSamtec Inc is a global manufacturer of electronic interconnect solutions, and they are seeking a Principal Optoelectronic Packaging Engineer to join their team at the Vista Design Center in Vista, CA. This role involves designing, developing, and implementing next-generation optoelectronic packaging solutions, while also mentoring engineers and collaborating with various teams to ensure successful outcomes.
ElectronicsHardwareManufacturingSoftware
Responsibilities
Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products
Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, etc.) materials (semiconductors, glass, laminates, ceramics, polymers, adhesives, etc.), and automated assembly techniques (SMT, wire bonding, die attach, curing, thermal bonding, spot curing, solder reflow, epoxy dispense, etc.)
Lead the development and integration of assembly processes in R&D, prototyping, and volume production environments. Apply Six Sigma methodologies (DMADV) and FMEA to design and document new processes. Ensure optical module reliability by conducting necessary testing to meet commercial and military standards
Interface with internal and external operations teams, collaborating closely with production teams on equipment and process improvements. Transfer scalable processes to manufacturing operations, both domestic and international
Mentor process development engineers on DOE (Design of Experiments) techniques, failure analysis, and operation of automated and mechanized equipment to support package builds for low, medium, and high-volume production
Work closely with marketing, process engineering, and R&D teams to align goals and realize outcomes
Qualification
Required
15-25 years of experience building optoelectronic packages in a manufacturing environment
10+ years conducting research on new materials and processes
10+ years developing processes on automated and semi-automated equipment
Direct experience working in a manufacturing environment, including familiarity with cleanroom protocols and equipment
Extensive knowledge of materials, interconnect technologies, equipment, and process development for optoelectronic module assembly
Deep understanding of automated and mechanized equipment used semiconductor packaging and assembly
Familiarity with 3D printing using polymers for various applications
Solid understanding of optical module reliability and testing protocols
Strong communication skills: Excellent written, verbal, and presentation abilities
Independent problem-solver with the ability to work within a multi-disciplinary engineering environment
Highly organized with the capacity to manage multiple priorities effectively
Proficient in Microsoft products with the ability to adapt to new software
BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering or an equivalent degree
Benefits
Medical (HSA/PPO)
Dental
Vision
Hearing
Group life
AD&D
Short- and long-term disability
EAP
401K match / profit sharing
Paid time off
Company
Samtec Inc
Founded in 1976, Samtec is much more than just another connector company.
5001-10000 employees
H1B Sponsorship
Samtec Inc has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (2)
2023 (1)
2021 (1)
2020 (1)
Funding
Current Stage
Late StageTotal Funding
$0.65M2009-10-23Series Unknown· $0.65M
Leadership Team
M
Marc Epitaux
Chief Architect
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