Embedded Engineering Internship - Summer 2026 jobs in United States
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Qualcomm · 11 hours ago

Embedded Engineering Internship - Summer 2026

Qualcomm Technologies, Inc. is a leader in innovation, focusing on transforming businesses and enriching lives through advanced technology. The Embedded Engineering Internship offers an opportunity to contribute to the development and maintenance of software for complex wireless devices, while gaining real-world experience in a collaborative environment.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
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Comp. & Benefits
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H1B Sponsor Likelynote

Qualification

CC++Embedded programmingPythonReal-time programmingDigital signal processingWireless protocolsSoft skills

Required

Currently enrolled in a bachelor's or master's degree program in computer engineering, computer science, electrical engineering, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as C, C++, Python, etc

Preferred

Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Embedded programming in C/C++/Assembly & operating system knowledge
Programming in resource-constrained environments (MIPS/Memory)
Implementation of complex algorithms on an embedded processor
Embedded microcontroller programming, experience developing device drivers
Real-time embedded programming in C/C++/Assembly for general purpose and heterogeneous processors including GPUs and DSPs
Communication systems, communication theory, digital signal processing (DSP, embedded firmware)
Knowledge of wireless protocols such as 5G NR, LTE, and 802.11

Benefits

Competitive hourly pay
Accrued vacation time
Relocation coverage
Furnished housing accommodations
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

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Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

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Cristiano Amon
President and Chief Executive Officer
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Isaac Eteminan
CEO
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Company data provided by crunchbase