Arm · 3 hours ago
Network Performance Engineer
Austin, TX
Full-time
Hybrid
Senior Level
5+ years expArm is a leading technology company focused on solving the world’s greatest challenges through innovative technology. They are seeking an experienced Signal and Power Integrity engineer to join their SIPI team, responsible for creating and analyzing System-in-Package designs and delivering robust design methodologies.
AnalyticsElectronicsInternet of ThingsSemiconductorSoftware
Responsibilities
Creating and analysing novel System-in-Package designs
Delivering robust design methodologies and silicon/platform electrical integrity solution spaces
Creating or supervising package designs and running specific packaging analysis tools
Participating in emerging interfaces definition and understanding impact on Arm IP
Supervising lab evaluations of the on post-silicon chip, including debugging and solving system level issues
Providing technical directions to the sub-workgroups and influencing key product/platform roadmap decisions
Developing pre-layout platform design guideline for SI/PI interfaces
Qualification
Required
Engineering degree or equivalent
You hold ideally 5 or more years of experience in System level Signal Integrity with focus on interfaces' impact on systems
Be very good at working with SIPI analysis environments (Ansys suite, Cadence, or other)
Have deep understanding of multi-port matrixes (S, Y, Z parameters)
Possess good understanding of electromagnetic extraction methodologies and their limitations
Understanding of package drawing to effectively drive a design engineer and perform package drawing modifications tasks on occasional basis
Able to provide technical directions to the sub-workgroups and influencing key product/platform roadmap decisions
Pre-layout platform design guideline development for SI/PI interfaces
Be able to mentor other SIPI engineers
Proficient in English with good communication skills, oral and written
Self-motivated, looking to accept new challenges
Ready to work in worldwide team setup and work seamlessly across teams
Attention to detail
Pro-active and pragmatic with regards to problem solving
Be willing to iteratively improve designs and repeatedly attempt to develop solutions to difficult problems
Preferred
Have good understanding SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks)
Experience in System level Power Integrity with focus on package level PI trade-offs
Experienced in complete package design flow from ball map stage up to final tape-out and well versed with all the steps and setup required
Knowledge in packaging manufacturing steps, and their constraints
Experience on advanced packaging (2.5D, 3D)
Knowledge of Linux environment and scripting (Python, Skill,…)
Company
Arm
Arm’s foundational technology is defining the future of computing. A future built by the greatest technology ecosystem in the world.
5001-10000 employees
H1B Sponsorship
Arm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (295)
2024 (166)
2023 (164)
2022 (123)
2021 (103)
2020 (133)
Funding
Current Stage
Public CompanyTotal Funding
unknown2016-07-18Acquired
1999-01-15IPO
Leadership Team
Rene Haas
CEO
Jason Child
EVP & CFO
Recent News
2026-01-09
Tech in Asia
2026-01-08
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