Software Engineer Intern (Compilers) - Summer 2026 jobs in United States
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Cadence ยท 14 hours ago

Software Engineer Intern (Compilers) - Summer 2026

positionSAN JOSE
timeInternship
remoteOnsite
seniorityIntern
workcardStart in 2026 Summer

Cadence is a technology company focused on developing leaders and innovators. They are seeking a Software Engineer Intern for the TIE compiler team, where the intern will work on translating TIE into efficient Verilog HDL implementation and fine-tuning open source LLM to design TIE codepilot.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

You will be a member of the TIE compiler (TC) team at the Compute System Group (CSG) of Cadence
The TIE compiler translates TIE into efficient Verilog HDL implementation and generates libraries used by the software tool chain
Fine tune open source LLM to design TIE codepilot (to generate new Instruction description in TIE language from natural language description)

Qualification

PythonC/C++Compiler designComputer architectureNatural language processingTeam collaborationEffective communication

Required

Currently enrolled in BS or MS majoring in CE, CS, EECS, or equivalent
Proficiency in programming languages such as Python, C/C++
Strong understanding computer architecture and experience working with processor ISA is a big plus
Experience with compiler design, language translation, or similar domain-specific tool development is a big plus
Knowledge of natural language processing (NLP) techniques and experience with language models is a big plus
Ability to work collaboratively in a team environment and communicate effectively

Company

Cadence

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Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
dateFounded in 1988
location
San Jose, California, USA
people-size10001+ employees
web-link
https://www.cadence.com

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Recent News

Morningstar.com
Cadence Announces Fourth Quarter and Fiscal Year 2025 Financial Results Webcast
2026-01-07
MarketScreener
Cadence Design Systems to integrate CUDA X technology into chip design software - Nvidia CEO at CES
2026-01-06
Business Wire
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
2026-01-06
Company data provided by crunchbase