GlobalFoundries · 14 hours ago
DMTS SiPh Packaging & Assembly Materials
Malta, NY
Full-time
Onsite
Senior Level, Lead/Staff
$166K/yr - $291K/yr
20+ years expGlobalFoundries is a leading full-service semiconductor foundry providing design, development, and fabrication services. The role focuses on driving the growth of the Photonix platform into fully packaged electro-optical transceiver offerings, emphasizing product reliability, packaging design, and innovation in photonic and electronic packages.
ElectronicsManufacturingSemiconductor
Responsibilities
Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts
Provides leadership and training of engineers in product packaging design reviews, materials selection and FMEAs of customer packaging concepts
Protects clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP, meets industry expectations
Ensures that all new technologies and features meet a standardized set of quality expectations tied to implementation into application representative packages for Data Centers, Automotive and Communications
Driving GF leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems
Provides tools and complex analysis of quality issues and associated financial implications
Protects the business by ensuring that all necessary requirements are met and that a technology performs to the expectations of a given customer or market to avoid costly re-designs
Ensures standardization of site-based quality processes are executed appropriately
Drives increased discipline and qualification robustness through a consistent global qualification process
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Qualification
Required
MS, or PhD + 20 or more years of experience
Expertise in photonic and electronic package architecture definition
Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing
Experience in bringing packaged products from development into production for data centers, automotive and communications
Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging
Preferred
A record of distinguished leadership on national and international levels such as contributing to national R&D agendas in science & technology, manufacturing
Participation in industry standards boards
Materials science, thermal, mechanical, simulation background
Extensive experience with failure analysis, design of experiments, & packaging process integration
Company
GlobalFoundries
GlobalFoundries is a full-service semiconductor foundry that manufactures integrated circuits in high volume.
10001+ employees
H1B Sponsorship
GlobalFoundries has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (114)
2024 (76)
2023 (66)
2022 (100)
2021 (87)
2020 (187)
Funding
Current Stage
Public CompanyTotal Funding
$4.39BKey Investors
European CommissionU.S. Department of CommerceU.S. Department of Defense
2025-12-11Grant· $579.33M
2024-11-20Grant· $1.5B
2024-05-22Post Ipo Secondary· $750M
Leadership Team
D
DK Sohn
VP
Jonathan Park
IP Strategy and Offering Management
Recent News
2026-01-03
vermontbiz.com
2026-01-03
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