GlobalFoundries · 10 hours ago
PMTS Silicon Photonics Packaging Integration
Malta, NY
Full-time
Onsite
Senior Level, Lead/Staff
$132K/yr - $242K/yr
15+ years expGlobalFoundries is a leading full-service semiconductor foundry providing design, development, and fabrication services. The Photonic Packaging Engineer will lead the development of advanced optical packaging solutions for silicon photonics and collaborate with various teams to ensure performance and reliability targets are met.
ElectronicsManufacturingSemiconductor
Responsibilities
Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration
Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O
Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration)
Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability
Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools
Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer
Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy
Present technical updates and roadmaps to internal stakeholders and external partners
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Qualification
Required
Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field
15+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging
Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques
Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration
Understanding of reliability standards and qualification methodologies for optical modules
Excellent analytical, problem-solving, and communication skills
Experience in bringing packaged products from development into production
Strong written and spoken English communication skills
Preferred
Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based)
Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems
Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL)
Familiarity with GF's Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows
Experience working with OSATs and managing external development partners
Demonstrated ability to lead cross-functional teams and influence technical direction
Company
GlobalFoundries
GlobalFoundries is a full-service semiconductor foundry that manufactures integrated circuits in high volume.
10001+ employees
H1B Sponsorship
GlobalFoundries has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (114)
2024 (76)
2023 (66)
2022 (100)
2021 (87)
2020 (187)
Funding
Current Stage
Public CompanyTotal Funding
$4.39BKey Investors
European CommissionU.S. Department of CommerceU.S. Department of Defense
2025-12-11Grant· $579.33M
2024-11-20Grant· $1.5B
2024-05-22Post Ipo Secondary· $750M
Leadership Team
D
DK Sohn
VP
Jonathan Park
IP Strategy and Offering Management
Recent News
2026-01-03
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2026-01-03
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