Intel Corporation · 7 hours ago
Foundry Technologist - Process Integration
US, Oregon, Hillsboro
Full-time
Hybrid
Senior Level, Lead/Staff
$248K/yr - $351K/yr
15+ years expIntel Corporation is seeking an accomplished Foundry Technologist - Process Integration to lead the development and customization of advanced foundry technologies. This role is pivotal in enhancing high-performance logic CMOS technology for a broad spectrum of applications, including AI, Datacenter, Client, and Edge solutions.
Semiconductors
Responsibilities
Lead a process development team focused on enabling and optimizing high-performance semiconductor logic technologies for large-volume manufacturing
Collaborate with cross-functional teams to gather customer requirements and translate them into tailored, innovative solutions
Drive the customization and implementation of semiconductor logic technologies, ensuring seamless integration with Intel’s established manufacturing processes and platforms
Provide technical guidance and mentorship to junior engineers and researchers, fostering a culture of continuous learning and professional growth
Monitor industry trends, emerging technologies, and evolving customer needs to inform process customization strategies and identify opportunities for ongoing improvement
Qualification
Required
Master's degree in Electrical Engineering, Physics, Material Science or a related field is required
Minimum of 15 years of experience in the semiconductor foundry industry, with a strong focus on technology development and, or customization
Minimum 5 years in Advanced CMOS technology and its customization
Proven track record of as part of foundry in developing and customizing logic technologies for specific customer requirements
Strong understanding of manufacturing processes and platforms, with experience in large volume manufacturing
Exposure to the foundry ecosystem is a requirement
Excellent leadership skills with the ability to lead cross-functional teams and drive collaboration
Excellent communication skills, both verbal and written, with the ability to convey complex technical concepts effectively
Preferred
Work in 3nm-16nm FinFET and sub 3nm GAA
Experience in Yield Improvement and High-Volume Manufacturing
Experience in Power-performance optimization
Experience in 3DIC development, including TSV (and interaction with CMOS, packaging)
Benefits
Competitive pay
Stock bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
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Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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