L3Harris Technologies · 7 hours ago
Lead, Embedded Software Engineer
Rochester, NY
Full-time
Onsite
Senior Level, Lead/Staff
$135K/yr - $250K/yr
7+ years expL3Harris Technologies is dedicated to recruiting high-performing talent in the defense industry. The Lead Embedded Software Engineer will design and implement embedded flight software for space-based imaging payloads, overseeing the complete software lifecycle from development to operation during missions.
CommercialInformation TechnologyNational Security
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Lead the design and implementation of real-time embedded flight software for space-based imaging payloads
Integrate and test embedded flight systems at the software/hardware level
Understand and apply architectural approaches for software design and implementation
Collaborate with other engineers to plan and develop solutions
Involve in all aspects of software development including design, documentation, testing, code reviews, and mission integration
Support development of test plans, procedures, traceability, reports, flow, and test case design and implementation
Contribute to requirements analysis, design, coding, unit testing, integration, and requirements verification
Create state charts, sequence diagrams, and other UML artifacts
Follow standard software development processes
Qualification
Required
Bachelor's degree in Computer Engineering, Computer Science, or related field with 9+ years of relevant experience; OR Graduate Degree with 7+ years of relevant experience; OR 13+ years of relevant experience in lieu of a degree
Experience in embedded software development, system design, debugging, and integration on flight-like hardware for space-based imaging payloads
Experience with RTOS (e.g., VxWorks, FreeRTOS, RTLinux, QNX), simulators (TSIM, VxSIM, SIMIC, MATLAB Simulink), and programming languages (C/C++, Python, scripting)
Active Top Secret or TS/SCI clearance or ability to obtain security clearance
Preferred
Proficiency in DevOps practices, Jenkins, and continuous integration tools
Familiarity with Versal, MicroBlaze, bare metal development, and kernel/device drivers
Experience with embedded command and control of mechanisms (e.g., shutters, motors, gimbals), embedded controllers (e.g., PIC, STM, TMS), serial communications (e.g., CAN, TCP/IP, RS422), and distributed messaging (TCP/UDP)
Experience with platforms like Raspberry Pi, Arduino, Intel x86, ARM, and System on a Chip
Expertise in full System lifecycle including requirements flow down and allocation, design, development, test, and sell-off
Knowledge of MBSE tools (e.g., Cameo) and wideband/narrowband telemetry and messaging
Experience in space payload systems and Core Flight System/Core Flight Executive (cFS/CFE)
Experience in Command & Control Software, Sensor Processing Systems, and Optical Systems/telescopes
Knowledge of microprocessor/microcontroller architecture and programming, and familiarity with FPGAs
Experience in estimating large software programs for new business opportunities
Proficiency in release engineering, change and configuration management, and continuous integration
Experience in developing software for microcontrollers with interfaces (e.g., I2C, SPI, UART, CAN)
Develop, customize, and maintain Board Support Packages (BSP) for various hardware platforms
Integrate BSP components, including bootloaders, device drivers, and operating systems
Optimize BSPs for performance, reliability, and efficiency
Working knowledge of image processors, visible cameras, IR detectors, servo motors, actuators and focus mechanisms
Familiarity with Cyber compliance tools (e.g., Fortify Workbench, SonarQube)
Familiarity with OMS (Open Mission Systems) and UCI (Universal Command and Control Interface) open architecture standards
Benefits
Health and disability insurance
401(k) match
Flexible spending accounts
EAP
Education assistance
Parental leave
Paid time off
Company-paid holidays
Company
L3Harris Technologies
L3Harris Technologies provides platform management system solutions for armed forces.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$2.25B2024-03-27Post Ipo Debt· $2.25B
1978-01-13IPO
Leadership Team
Tania Hanna
Vice President Government & Customer Relations
Chip Teets
Senior Director, International Programs, Products & Technology
Recent News
2026-01-11
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