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SpaceX · 12 hours ago

IC Packaging Engineer, Silicon Technology (Starlink)

Bastrop, TX

Full-time

Onsite

Entry, Mid Level

1+ years exp

SpaceX is a pioneering aerospace manufacturer and space transport services company focused on enabling human life on Mars. They seek an IC Packaging Engineer with expertise in semiconductor packaging design and process development to oversee packaging assembly processes and ensure the transition from concept to mass production for their Starlink broadband internet system.

Advanced MaterialsAerospaceManufacturingNational SecuritySpace Travel

Growth Opportunities

No H1B

U.S. Citizen Only

Responsibilities

Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems

Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach

Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines

Own packaging prototypes, product development, and release to production

Select equipment and material to meet quality, reliability, cost, yield, and production targets

Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements

Cross-functional interface with IC design, materials, thermal, systems, and production teams

Implement advanced packaging solutions into SpaceX next generation products

Qualification

Semiconductor packaging designMicroelectronics packagingPackaging process developmentAdvanced technical degreeHands-on packaging experienceOSAT experienceElectrical EngineeringMechanical EngineeringChemical EngineeringMaterials SciencePhysics

Required

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or other Engineering discipline

1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)

Ability to work extended hours or weekends as needed for mission critical deadlines

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State