Altera · 4 days ago
Senior OSAT Engineer
Altera is a global leader in FPGA and programmable logic solutions, enabling innovation in various markets. They are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across their global supplier network, focusing on NPI readiness, yield optimization, and cost improvements for their FPGA/SoC product lineup.
Enterprise SoftwareManufacturingSemiconductorSoftware
Responsibilities
Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness
Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products
Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage
Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions
Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements
Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT
Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements
Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans
Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q)
Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management
Qualification
Required
Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
10+ years of semiconductor assembly, packaging, or test engineering experience
Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in
Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis
Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements
Demonstrated success working with international suppliers and cross-functional teams
Strong written and verbal communication skills, including technical reporting and supplier engagement
Preferred
FPGA, ASIC, or SoC backend experience, particularly high-pin-count or high-power devices
Experience in automotive or high-reliability product qualifications (AEC-Q / ISO standards)
Familiarity with advanced packaging: 2.5D/3D, fan-out WLP, heterogeneous integration
Knowledge of supply chain risk mitigation, dual sourcing, and volume scaling strategies
Experience with automation, traceability systems, and smart factory/manufacturing analytics
Benefits
Incentive opportunities that reward employees based on individual and company performance
Company
Altera
Altera provides programmable logic devices and design software for various applications. It is a sub-organization of Intel.
H1B Sponsorship
Altera has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (67)
Funding
Current Stage
Public CompanyTotal Funding
unknown2025-04-14Acquired
1988-03-31IPO
Recent News
Business Wire
2025-11-25
2025-11-19
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