ASIC/FPGA Design Engineer III jobs in United States
cer-icon
Apply on Employer Site
company-logo

Lockheed Martin · 7 hours ago

ASIC/FPGA Design Engineer III

Lockheed Martin is a leader in space technology, and they are seeking an ASIC & FPGA Design Engineer to support various programs and R&D efforts. The role involves comprehensive ASIC and FPGA development, technical reviews, and collaboration with verification teams.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
check
Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

Work with low SWaP, radiation hardened, space rated devices
Perform all aspects of ASIC and FPGA development through the lifecycle from initial requirements capture through architecture, design, analysis, simulations and test in a Linux-based high-performance computing environment
Support technical reviews and present to internal and external stakeholders
Interface with an independent verification team who will be working in parallel, verifying the design

Qualification

ASIC developmentFPGA designLinux environmentSpace-grade FPGAsAMD Versal FPGAsMicrochip RTG4 FPGAsEthernet protocolsMS ProjectJIRALab testing

Required

3+ years professional experience
US Citizenship is required
You need to be an independently minded and well organized engineer, comfortable in laboratory digital environments, and able to respond and interact with a dynamic fast-moving team

Preferred

Knowledge of space-grade/qualified FPGAs
Experience or knowledge of MS Project, JIRA
Knowledge of Linux drivers, NVM (NAND/MRAM), Flash Management, Ethernet protocols
Experience designing with AMD Versal, Microchip RTG4 FPGAs
Lab testing experience

Company

Lockheed Martin

company-logo
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

leader-logo
Jim Taiclet
Chairman, President & CEO
linkedin
leader-logo
Craig Martell
Chief Technology Officer
linkedin
Company data provided by crunchbase