Lead Solutions Engineer jobs in United States
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Cadence · 22 hours ago

Lead Solutions Engineer

Cadence is a company focused on advanced physical verification technologies for semiconductor designs. The Lead Solutions Engineer will validate and optimize verification technologies, ensuring solutions meet stringent requirements through collaboration with design teams and R&D.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Close collaboration with design teams, product engineering, and R&D to ensure verification solutions meet stringent requirements for successful deployment in production design flows
Executing and analyzing complex verification flows—including running large design sets and customer designs—to ensure accuracy, performance, and scalability across hierarchical design environments
Profiling solutions, running leading-edge designs, and identifying bottlenecks to drive tool and flow improvements

Qualification

VLSI designSemiconductor manufacturingDevice physicsProgrammingIC Design FlowFast learnerProblem solvingOut-of-the-box thinking

Required

Work experience in VLSI design
Strong understanding of semiconductor manufacturing
Device physics and modeling
Must be a fast learner
Must demonstrate strong aptitude for out-of-the-box thinking and problem solving

Preferred

A strong background in programming would be a plus
Strong understanding of IC Design Flow

Company

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Company data provided by crunchbase