Principal Design Engineer, NVEG jobs in United States
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Micron Technology · 13 hours ago

Principal Design Engineer, NVEG

Micron Technology is a world leader in innovating memory and storage solutions. The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Manage major block design (IO top, pad top, tile dp) placement, floor-planning, and architecture based on project timing, area, and power requirements. Drive major block validation activities
Perform block level HSPICE, full chip level timing, or functional validation of any mode/function of datapath
Lead full chip XA environment setup
Communicate with project teams and other functional teams on design and specifications of major block interfaces
Evaluate post-silicon timing issues, marginality issues, and yield drop through root-cause analysis
Communicate with PE to drive silicon experiments and propose fixes and improvements. Communicate with Apps regarding introduction of new specs and limitations based on design requirements and limitations
Communicate with device modeling and CMOS process teams on CMOS device model and device characteristic change requests based on design requirements
Collaborate with ASIC, MNAND, SSD, and Signal Integrity teams to understand different NAND ecosystem environments, limitations, and usage cases, incorporating this understanding into NAND IO design

Qualification

High-speed IO circuit designChip architecture optimizationDevice characterization techniquesPhysical design flowsEDA tools CadenceEDA tools HSPICEPython for automationMatlab for design flowRoot-cause analysisFMEA principlesLean Six Sigma certificationProject managementCommunication skills

Required

BS or MS in Electrical Engineering with 8+ years of relevant experience
Advanced knowledge and understanding of high-speed IO circuit performance, power and area optimization, and chip architecture/floorplan
Experience with managing complex design projects, effectively communicating progress and outcomes
Demonstrated experience with device characterization and modeling techniques
Advanced use of yield enhancement, root-cause analysis, and FMEA principles
Experience in physical design flows and optimization

Preferred

PHD with 5+ years of relevant semiconductor industry experience
Experience with EDA tools (cadence, HSPICE, XA, Verilog), plus Python and Matlab for design flow automation
PMP or Lean Six Sigma certification

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase