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Employnet, Inc. · 12 hours ago

Senior Radio Frequency Engineer - Remote

United States

Full-time

Remote

Senior Level

7+ years exp

Employnet, Inc. is seeking a Remote Senior RF Engineer with expertise in Ansys HFSS and high-speed PCB design. The role involves designing and validating PCB-based RF structures and high-speed serial channels, owning the end-to-end design process, and collaborating with cross-functional teams to integrate RF and high-speed designs into products.

EmploymentRecruitingStaffing Agency

Growth Opportunities

Responsibilities

EM Design & Simulation (HFSS)

Build detailed 3D models of microstrip/stripline transitions, coax/board launches (SMP/SMPM, right-angle/high-density mezzanines), and connector breakouts

Run adaptive meshing, parametric sweeps, and optimization for return loss, insertion loss, isolation, and mode conversion (Sdd/Sdc/Scc)

Extract and post-process S parameters, validate de-embedding, and ensure robust correlation with lab measurements

RF Circuits & Passive Networks

Design Wilkinson dividers (single/dual/multi-section) for target bandwidths, isolation, and power balance; implement isolation resistors and quarter-wave line sections in microstrip/stripline

Design stripline filters (coupled line, interdigital, hairpin, Chebyshev/elliptic responses) and optimize for ripple, stopband rejection, and manufacturability

High-Speed Serial (up to 22 Gbps)

Architect and simulate differential channels including connector launches, breakouts, vias, ground return, and reference transitions

Evaluate Sdd21/IL, NEXT/FEXT, skew, and mode conversion; perform TDR/TDT analysis; assess eye width/height, COM, and system-level margin with CTLE/DFE equalization as needed

Stackup & Materials / DFM

Define PCB stackups and materials (low-loss laminates, copper roughness models, dielectric dispersion, via anti-pads/back-drill strategies, stitching/ground fences, reference plane management)

Collaborate with PCB vendors on manufacturability, tolerances, and fabrication notes; ensure designs are robust to process variation and rework

Measurement & Correlation

Create test plans and fixtures; perform VNA measurements (up to 26–40 GHz), S-parameter quality checks, and time-domain analyses

Own the correlation loop: simulation → fixture calibration/de-embedding → measurement → iterative model refinement

Documentation & Cross-Functional Work

Deliver design reviews, simulation reports, S-parameter libraries, fabrication drawings, and validation summaries

Partner with EE, ME, SI/PI, compliance, manufacturing, and firmware teams to integrate RF and high-speed designs into products

Qualification

Ansys HFSSRF/Microwave DesignHigh-Speed PCB DesignS parametersDifferential ChannelsPCB Stackup DefinitionVNA MeasurementsCommunication SkillsCollaborationMentoring

Required

BS/MS in Electrical Engineering (or related); 7+ years relevant RF/Microwave or high-speed design experience (or 5+ years with MS/PhD and strong portfolio)

Expert-level Ansys HFSS experience (3D modeling of connectors/launches, adaptive meshing, parametric optimization, scripting/macros, results post-processing)

Proven track record designing microstrip/stripline transitions, connector launches, Wilkinson dividers, and stripline filters up to 26 GHz

Hands-on experience with 22 Gbps differential serial channels: channel modeling, S-parameter quality checks, TDR/TDT, eye diagram analysis, crosstalk, and mode conversion control

Strong command of S parameters (mixed mode), de-embedding, causality/passivity enforcement, and fixture/model correlation

Familiarity with low-loss PCB materials (Rogers, Megtron, Tachyon), stackup definition, copper roughness models (Huray/GMS), and via engineering (back-drill, blind/buried, anti-pad design)

Competence with lab instrumentation: VNA, high-bandwidth oscilloscopes, TDR/TDT, BERT (as applicable), fixturing, and calibration

Ability to read and generate fabrication documentation (drawings, stackups, layer maps, impedance tables, DFM notes) and collaborate effectively with PCB vendors

Preferred

Experience with HFSS 3D Layout/SIwave, HyperLynx, or equivalent SI/EM tools for co-simulation and workflow integration

Familiarity with balanced/unbalanced launch design (GCPW to microstrip/stripline, baluns), EM-extracted model integration into circuit simulators, and multi-physics considerations (thermal/mechanical)

Statistical modeling of tolerances/DFM (Monte Carlo on critical dimensions) and yield-aware design

Scripting for automation (Python, MATLAB) and version control for simulation artifacts and S-parameter libraries

Experience with connector families at microwave frequencies (SMP/SMPM, high-speed board-to-board mezzanines) and coax-to-PCB launches

Strong communication skills and the ability to lead design reviews, mentor, and drive decisions across cross-functional teams