Marvell Technology · 6 hours ago
Package Development, Signal Integrity and Power Integrity Engineer, Senior Principal
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$169K/yr - $253K/yr
12+ years expMarvell Technology is a leader in semiconductor solutions that form the backbone of data infrastructure. They are seeking a Senior Principal Engineer in Package Development, focusing on signal and power integrity for next-generation high-performance computing and AI solutions.
DSPInternet of ThingsManufacturingSemiconductorWireless
Responsibilities
Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments
Proven track record of new product introduction from concept, through development and production
Proven track record of technical leadership in the organization
Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
Experience with 2.5D/3D package development is highly desired
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Drive netlists for the package development with tools like ISP (Integrated System Planner) or equivalent tools (XSI or others)
Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
Knowledge of the thermal and mechanical issues of the IC package development
Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
Working knowledge of solving and debugging issues in the lab for high-speed systems
Strong communication, presentation, and documentation skills
A team player
Qualification
Required
Bachelor's degree in Computer Science, Electrical Engineering or related fields and 15-20 years of related professional experience
Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments
Proven track record of new product introduction from concept, through development and production
Proven track record of technical leadership in the organization
Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Drive netlists for the package development with tools like ISP (Integrated System Planner) or equivalent tools (XSI or others)
Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
Knowledge of the thermal and mechanical issues of the IC package development
Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
Working knowledge of solving and debugging issues in the lab for high-speed systems
Strong communication, presentation, and documentation skills
A team player
Preferred
Experience with 2.5D/3D package development is highly desired
Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 12-18 years of experience
Benefits
Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
Recent News
2026-01-12
2026-01-11
Fierce Network
2026-01-11
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