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Northrop Grumman · 6 hours ago

Microelectronic Technician 3 - R10219172

Apopka, FL

Full-time

Onsite

Mid Level

$58K/yr - $96K/yr

4+ years exp

Northrop Grumman is a leading company in technological advancements and is seeking a Microelectronic Technician 3 to join their team. The role involves performing technical, chemical, and photolithography duties related to semiconductor materials and devices, including equipment operation, process examination, and quality control.

AerospaceData IntegrationManufacturingRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Run fabrication equipment for processing semiconductor materials and devices under the guidance of process documentation, which includes the setup and operation of a variety of standard and special solid-state processing equipment. This includes performing various chemical, physical, photographic, and packaging processes such as deposition, evaporation, and etching of materials, metals plating, wafer dicing /thinning, and making/requesting adjustments based upon the knowledge of process and procedures, and monitoring equipment when applicable

Examine processes such as resist/develop processing, photo exposure, metallization, and etching to determine the quality of the process to locate defects. Determine and discuss with the engineer possible improvements in the process or equipment to remedy defects

Interpret SPC (Statistical Process Control) charts to react to out-of-control conditions to maintain process control. Prepare reports or parts of reports following established patterns. Covering work assignments such as preparing masks, operating photographic equipment, and developing photographic films

Placing lots on hold, based on engineering guidance, disposition lots, and document in MES. Performing tasks such as running split lots for engineering, ensuring special processing is consistent and on time. Performing gage R&R (repeatability & Reproducibility) studies for metrology equipment

Qualification

Semiconductor process equipmentWafer handlingData collectionStatistical Process ControlMetrology equipmentTeam collaborationProblem-solving

Required

High school graduate or recognized equivalent

Associate's degree or two years (minimum 60 semester hours) of college-level study with a major in a physical science or equivalent; or 4 years of relevant experience

4 years of prior manufacturing experience or 1.5 years of previous technician experience processing wafers in the semiconductor bump line

Ability to lift, hold, move, and manipulate the wafers in a FOUP (Front Opening Unified Pod) to 25 pounds and with a wand as applicable

The ability to obtain and maintain a Department of Defense (DoD) Secret clearance

U.S. citizenship required