Advanced Microdevices Pvt. Ltd. (India) ยท 1 day ago
Silicon Photonics Reliability Engineer
Advanced Micro Devices, Inc (AMD) is dedicated to building innovative products that drive next-generation computing experiences. The Silicon Photonics Reliability Engineer will focus on establishing leading reliability solutions for advanced silicon photonics products, collaborating with various teams to ensure best practices and addressing reliability challenges.
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Responsibilities
Collaborate with silicon design, product & test, and packaging teams to architect & define reliability solutions for silicon photonics at wafer-level and CPO-level
Collaborate with design, packaging, and key suppliers to understand structural and parametric mechanisms for reliability and quality issues
Interface with suppliers to provide technical inputs & reliability requirements to enable production-worthy end-to-end solutions
Deep knowledge to train other teams & engineers in the field of silicon photonics across design, packaging and volume test
Responsible for identifying & mitigating reliability challenges and executing large technical projects and processes in a timely manner
Expertise with fundamental reliability physics of leading silicon photonics foundry process technologies and advanced packaging technologies
Expertise with end-to-end reliability and failure analysis, implementing POF models, stress testing methodologies (JEDEC/standards based, thermal/humidity cycling, electromigration, electrical overstress, etc), and root-cause analyses using advanced analysis techniques (FIB, SEM/TEM, EDX, etc)
Develop and implement corrective actions to prevent recurrence of failures
Collaborate with design, packaging and process engineering teams to identify root causes and implement effective changes
Employ statistical analysis and problem-solving techniques to identify root causes of failures
Analyze failure data to identify trends and patterns
Generate comprehensive failure analysis reports and presentations
Communicate complex technical information to a wide range of audiences
Deep knowledge of key theoretical approaches, modeling and analytical techniques to assess and project failure distributions, early failures, wearout failures, lifetime projections and FIT rates
Deep knowledge of accelerated stress approaches such as HTOL, HAST, ESD/LU and others
Experience with stress hardware such as controlled temperature chambers, liquid heat exchanger apparatus, air flow apparatus, wafer chucks and other approaches
Familiarity with test equipment station SPC/EOM and control charts
Experience with stress experiment design including readpoint intervals and readpoint analysis
Specify and develop critical infrastructure and develop vendor relationships to evaluate critical reliability metrics and set the standard for laboratory evaluation and FA
Devise and quantify critical FMEA framework for silicon photonics technologies and advanced packaging technologies
Create roadmaps to evolve and continuously improve reliability experiments, data analysis approaches and FA techniques
Collaborate cross-functionally with R&D, silicon photonics, optics, and SoC teams to align on product roadmaps, perform risk assessments and drive continuous improvements in yield, cost, and scalability for AI hardware
Collaborate with qualification engineering teams to design effective stress metrics and experiments
Specify and develop test fixtures in collaboration with Hardware, PCB, and Firmware engineers
Develop data analysis and test automation software in collaboration with design engineers
Qualification
Required
Engineering experience in semiconductor reliability with a focus on silicon photonics
Proven ability to tackle complex reliability challenges for various silicon photonics & optical interconnect technologies
Excellent communication and coordination across various teams
Define long-term reliability solutions
Collaborate with silicon design, product & test, and packaging teams to architect & define reliability solutions for silicon photonics at wafer-level and CPO-level
Collaborate with design, packaging, and key suppliers to understand structural and parametric mechanisms for reliability and quality issues
Interface with suppliers to provide technical inputs & reliability requirements to enable production-worthy end-to-end solutions
Deep knowledge to train other teams & engineers in the field of silicon photonics across design, packaging and volume test
Responsible for identifying & mitigating reliability challenges and executing large technical projects and processes in a timely manner
Expertise with fundamental reliability physics of leading silicon photonics foundry process technologies and advanced packaging technologies
Expertise with end-to-end reliability and failure analysis, implementing POF models, stress testing methodologies (JEDEC/standards based, thermal/humidity cycling, electromigration, electrical overstress, etc), and root-cause analyses using advanced analysis techniques (FIB, SEM/TEM, EDX, etc)
Develop and implement corrective actions to prevent recurrence of failures
Collaborate with design, packaging and process engineering teams to identify root causes and implement effective changes
Employ statistical analysis and problem-solving techniques to identify root causes of failures
Analyze failure data to identify trends and patterns
Generate comprehensive failure analysis reports and presentations
Communicate complex technical information to a wide range of audiences
Deep knowledge of key theoretical approaches, modeling and analytical techniques to assess and project failure distributions, early failures, wearout failures, lifetime projections and FIT rates
Deep knowledge of accelerated stress approaches such as HTOL, HAST, ESD/LU and others
Experience with stress hardware such as controlled temperature chambers, liquid heat exchanger apparatus, air flow apparatus, wafer chucks and other approaches
Familiarity with test equipment station SPC/EOM and control charts
Experience with stress experiment design including readpoint intervals and readpoint analysis
Specify and develop critical infrastructure and develop vendor relationships to evaluate critical reliability metrics and set the standard for laboratory evaluation and FA
Devise and quantify critical FMEA framework for silicon photonics technologies and advanced packaging technologies
Create roadmaps to evolve and continuously improve reliability experiments, data analysis approaches and FA techniques
Collaborate cross-functionally with R&D, silicon photonics, optics, and SoC teams to align on product roadmaps, perform risk assessments and drive continuous improvements in yield, cost, and scalability for AI hardware
Collaborate with qualification engineering teams to design effective stress metrics and experiments
Specify and develop test fixtures in collaboration with Hardware, PCB, and Firmware engineers
Develop data analysis and test automation software in collaboration with design engineers
MS or PhD in Electrical, Computer Engineering, Optics & Photonics Engineering, or comparable disciplines
Preferred
Proven experience in the field of optical interconnects and silicon photonics
Familiar with general test & manufacturing of silicon photonics including burn-in and temperature testing in HVM
Good communication skills and ability to work with geographically distributed engineering teams
Recommend and develop DOE structures for silicon photonics tapeouts to quantify critical reliability parameters
Evaluate and apply reliability guidelines from silicon photonics foundries to optimize functional and reliability performance
Establish DFR methodologies and collaborate with CAD and design teams to utilize and evolve advanced reliability simulation techniques
Experience with fault isolation techniques via bench, wafer prober and ATE platforms
Software development for data analysis and test automation such as JMP, Minitab, PyVISA, MATLAB and other tools
Hands-on experience with laser module reliability and qualification
Experience with reliability of advanced CMOS and other high performance semiconductor process technologies
Experience with high-reliability telecom product development and manufacturing
Knowledge of ISO-9000 and TL-9000 QMS systems
Experience with GR-468 and other qualification standards and frameworks
Familiarity with wireline and optical communication systems with concepts such as optical-signal-to-noise ratio, receiver sensitivity, optical modulation amplitude, and optical filtering
Hands-on experience with high-speed test equipment such as bit error rate testers, digital communication analyzers, real-time oscilloscopes, vector network analyzers, and arbitrary waveform generators
Hands-on experience with optical test equipment, including swept laser sources, power meters, optical spectrum analyzers, optical time domain reflectometers, optical amplifiers, and best practices in optical test systems
Hands-on experience with advanced electrooptic wafer and die-level test systems
Experience leading reliability and qualification engineers and technician personnel
Strong industrial experience with reliability of leading edge EIC/PIC products in high-volume production
Benefits
AMD benefits at a glance.
Company
Advanced Microdevices Pvt. Ltd. (India)
Advanced Microdevices (mdi) is a leader in innovative membrane technologies.
Funding
Current Stage
Late StageLeadership Team
Nalini Kant Gupta
Founder & Managing Director
Recent News
2024-10-18
2024-10-16
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