Lockheed Martin · 1 day ago
Electronics Packaging Analyst III, Telework
United States
Full-time
Remote
Mid Level
3+ years expLockheed Martin is a leading aerospace and defense company, and they are seeking an Electronics Packaging Analyst III to join their Electronics Packaging department. The role involves responsibilities for electronics packaging development, including mechanical design, stress and thermal analysis, and CAD drawing development and release.
AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
Responsibilities
Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools
Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity
Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters
Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality
Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results
Qualification
Required
Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools
Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity
Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters
Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality
Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results
3+ years professional experience
Preferred
Ability to work in a collaborative and highly integrated team environment
Experience with thermal and structural fatigue analysis of electronic components and attachments
Experience with NASTRAN, NX Advanced Simulation, Abaqus, Matlab, Mathcad and CREO
Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware
Familiarity with different electronic package types and mounting methods
Possess good communication, both oral and written, social and presentation skills
Proficient in Microsoft Office, especially Excel
Company
Lockheed Martin
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.
10001+ employees
H1B Sponsorship
Lockheed Martin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
2022 (1)
2021 (2)
Funding
Current Stage
Public CompanyTotal Funding
$6.06BKey Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M
Leadership Team
Jim Taiclet
Chairman, President & CEO
Craig Martell
Chief Technology Officer
Recent News
2026-01-13
2026-01-11
Company data provided by crunchbase