Lockheed Martin · 14 hours ago
Electronics Packaging Analyst III, Telework
United States
Full-time
Remote
Mid Level
$89K/yr - $158K/yr
3+ years expLockheed Martin is a leading technology innovation company seeking an Electronics Packaging Engineer within their Electronics Packaging department. The role involves responsibilities for electronics packaging development, including mechanical design, stress and thermal analysis, and CAD drawing development and release.
AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
Responsibilities
Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools
Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity
Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters
Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality
Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results
Qualification
Required
Bachelor of Science or higher from an accredited college in Mechanical Engineering or related discipline, or equivalent experience/combined education
Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools
Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity
Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters
Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality
Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results
3+ years professional experience
Understand the basics of electronics packaging analysis, either through education or work experience, and be willing to learn and apply new/advanced analytical techniques necessary to perform various analysis tasks
Knowledge of and applicable experience with spacecraft or missiles analysis methods, specifically for electronic components, and including hand calculations
Experience with finite element modeling for random vibration and thermal analysis
Preferred
Ability to work in a collaborative and highly integrated team environment
Experience with thermal and structural fatigue analysis of electronic components and attachments
Experience with NASTRAN, NX Advanced Simulation, Abaqus, Matlab, Mathcad and CREO
Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware
Familiarity with different electronic package types and mounting methods
Possess good communication, both oral and written, social and presentation skills
Proficient in Microsoft Office, especially Excel
Benefits
Medical
Dental
Vision
Life Insurance
Short-Term Disability
Long-Term Disability
401(k) match
Flexible Spending Accounts
EAP
Education Assistance
Parental Leave
Paid time off
Holidays
Company
Lockheed Martin
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.
10001+ employees
H1B Sponsorship
Lockheed Martin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
2022 (1)
2021 (2)
Funding
Current Stage
Public CompanyTotal Funding
$6.06BKey Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M
Leadership Team
Jim Taiclet
Chairman, President & CEO
Craig Martell
Chief Technology Officer
Recent News
2026-01-13
2026-01-11
2026-01-11
Company data provided by crunchbase