Module Process Engineer jobs in United States
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Apple · 9 hours ago

Module Process Engineer

Apple is seeking a highly motivated process development and integration engineer to join the Display Technologies Organization. The individual will serve as a key focal point in the process development and integration of advanced display modules, driving the process from proof-of-concept to volume manufacturing.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Drive the display or optical module process end to end, from proof-of-concept to volume manufacturing

Qualification

Process developmentFailure mode analysisOpto-mechanical designPrecision mechanical systemsOptical precision positioningMicro-assemblyStatistical analysisProject managementCommunication skillsProblem-solving

Required

B.S. Degree minimum in Physics, Materials Science, Mechanical Engineering, or a related field and 3 years of relevant industry experience
Experience in leading a project from early development to high-volume production
Experience in failure mode analysis, root cause investigation, and problem-solving for product yield and quality issues
Experience in EQ/Process development in Camera, Sensor, MEMS, precision optics, Semiconductor, or other related industries
Experience in precision mechanical systems, precision assembly, flexures, and calibration systems and/or in designing or tuning opto-mechanical fixtures for active alignment, including adjustment degrees of freedom and alignment strategies

Preferred

Ph.D. or M.S. degree in Physics, Material Science, or Mechanical Engineering with 5+ years of experience in a related field is preferred
Excellent written and verbal communication skills and demonstrated leadership ability
Project Management Skills: Excellent data handling, documentation, critical milestone creation, and organization skills
Experience with optical precision positioning systems that utilize force or position-controlled transmission mechanisms
Experience with precision adjustment mechanisms such as fine-pitch screws, flexure stages, and clamps, along with best practices for locking alignment after active alignment
Experience with various actuators, including piezoelectric, electrothermal, electrostatic, electromagnetic, and voice-coil
Experience in micro-assembly, including adhesive selection and dispensing, curing, welding technology, or precision fastening systems
Experience in autofocus systems like VCM, OIS, etc
Experience in spring system engineering, like post assembly stiffness adjustment, real-time spring constant tuning, and spring solutions for auto-thermal compensation
Experience in advanced singulation processes, like laser, blade saw, scribe wheel, and plasma
Knowledge of lens mounting, stress control, and optical alignment tolerances (tilt, decenter, focus) for micro-assembly
Experience in process integration and qualification
Experience in calibration methodologies, measurement systems, and statistical analysis
Experience with thermal analysis, stress analysis, and multi-physics simulation tools

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

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Tim Cook
CEO
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Craig Federighi
SVP, Software Engineering
Company data provided by crunchbase