IC Package Integration Engineer jobs in United States
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Apple · 7 hours ago

IC Package Integration Engineer

Apple is a company that believes in turning new ideas into extraordinary products and services. They are looking for a hardworking and passionate IC Packaging Engineering Lead to work on groundbreaking technologies and lead package integration efforts.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Work with cross-functional teams and lead package integration and architecture efforts
Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs ~10% International travel
Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development

Qualification

Semiconductor Packaging DesignProcess & Technology DevelopmentAdvanced Packaging TechnologiesSignal Integrity / Power IntegrityThermal ManagementReliability TestingCommunicationProblem SolvingTeam LeadershipIndependent Work

Required

BS and +10 years of relevant industry experience

Preferred

Experience in Semiconductor Packaging Design, Process & Technology Development
Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FAn
Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
Excellent problem solving with strong physics and fundamentals
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost
Ability to work independently and take on projects with minimum supervision
Ability to lead and manage teams
Knowledge of Cellular packaging and systems a plus

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

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Tim Cook
CEO
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Craig Federighi
SVP, Software Engineering
Company data provided by crunchbase