Silicon Photonics u0026 Optical Packaging Eng jobs in United States
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Apple · 1 week ago

Silicon Photonics u0026 Optical Packaging Eng

Apple is seeking a hardworking and passionate Silicon Photonics & Optical Packaging Engineer to join their team. In this role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions, lead technology development, and work with cross-functional teams to optimize performance and reliability in optical interconnect applications.

AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Responsible to lead Si photonics packaging technology development
Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts
Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation
Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM
Minimum 5% International travel

Qualification

Silicon PhotonicsOptical PackagingOptical Coupling DesignFiber-Coupled DevicesCMOS BEOL ProcessingOptical Component DesignTeamworkCommunication SkillsHands-on Experience

Required

BS and 10+ years of experience in relevant industry experience

Preferred

M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred
Excellent teamwork and communication skills
Strong theoretical background in optics and photonics fundamentals, device/module integration
Hands-on experience in packaging and measuring fiber-coupled devices
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool
Min. 5 years works experiences in the related field with M.S and or Ph.D
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …)
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus

Benefits

Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation

Company

Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.

H1B Sponsorship

Apple has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)

Funding

Current Stage
Public Company
Total Funding
$5.67B
Key Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity

Leadership Team

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Tim Cook
CEO
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Craig Federighi
SVP, Software Engineering
Company data provided by crunchbase