Apple · 11 hours ago
Process Engineer
California, United States
Full-time
Onsite
Senior Level, Lead/Staff
$181K/yr - $318K/yr
10+ years expApple's ATG Sensing Group is seeking a Senior Electronic Packaging Engineer to develop innovative module packaging solutions for new consumer products. The role involves owning the process development of New Product Introduction, collaborating with cross-functional teams and external partners to solve integration challenges and bring next-generation sensing technologies to market.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Drive the development of innovative module packaging solutions for new consumer products
Own the process development of New Product Introduction
Architect new concepts and define process flows to ensure successful high-volume manufacturing with external OSAT partners
Collaborate with internal cross-functional teams and external suppliers to solve complex integration challenges
Develop and deploy new packaging technologies for consumer markets
Qualification
Required
BS and 10 +years of relevant industry experience
Proven track record of successfully shipped products with 3rd party manufacturing partners
Ability to lead cross functional teams to success
Experience operating independently as well as collaboratively in a complex multi-disciplinary development program
Preferred
Understand and keep up-to-date with industry landscape on relevant technologies
Strong interpersonal and team-building skills
Proven track record of work with OSAT to bring up a product from conceptual to MP stage
Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging interactions and reliability failures
Proficient in applying DOE vs. Hypothesis tool for root cause analysis
Excellent written and verbal communication skills
In-depth knowledge in the area of semiconductor sensor packaging technologies
Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes
Working level knowledge in wafer bumping, RDL, and TSV
Experience in using simulation to guide process setup
Experience in using AI to support process development
Experience in capacitive sensing module packaging
Experience in customer facing cosmetic packaging
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
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2025-12-01
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2025-09-25
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