Thermal Engineer jobs in United States
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Foxconn Industrial Internet · 12 hours ago

Thermal Engineer

Foxconn Industrial Internet is seeking a highly skilled Thermal Engineer for their Server R&D Team, specializing in thermal management design for server and rack products. The role involves developing thermal solutions from concept to mass production, utilizing advanced simulation and testing techniques to ensure product performance and reliability.

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H1B Sponsor Likelynote

Responsibilities

Lead thermal management design for server and rack systems, including chip, board, system, and rack-level thermal solutions
Conduct thermal simulation and optimization using advanced tools such as FloTherm, Icepak, and Ansys CFD
Plan and execute thermal tests, including operating environmental chambers to validate design performance and reliability
Analyze and optimize airflow management systems and design efficient cooling solutions, such as liquid cooling or hybrid cooling technologies
Collaborate with cross-functional teams (mechanical design, electrical design, and manufacturing) and customers to ensure designs meet thermal performance, production requirements, and client-specific needs
Actively participate in customer technical review meetings, provide design recommendations, and resolve technical issues promptly
Build strong client relationships by working closely with customers to refine technical solutions and ensure alignment with their expectations
Review and evaluate new technologies and materials to ensure thermal design meets industry trends and future needs
Prepare detailed test reports and technical documentation to support internal and customer design reviews
Work closely with Taipei and other global R&D centers, requiring strong communication skills in English and Mandarin

Qualification

Thermal designThermal simulation toolsThermodynamicsFluid dynamicsLiquid cooling solutions3D/2D CAD toolsAnalytical skillsCustomer communicationPDM systemsProblem-solving skillsCommunication skills

Required

Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering
At least 5 years of experience in thermal design for servers and racks, with familiarity with cloud computing and data center requirements
Deep understanding of thermodynamics, heat transfer, and fluid dynamics, with practical application in design and testing
Expertise in thermal simulation tools (e.g., FloTherm, Icepak, Ansys CFD) and 3D/2D CAD tools (e.g., PTC Creo, SolidWorks, UG NX)
Hands-on experience with server thermal testing equipment, including environmental chambers and airflow measurement devices
Ability to develop and optimize liquid cooling solutions and a strong understanding of hybrid cooling technologies
Familiarity with fan module design and airflow control techniques
Excellent analytical and problem-solving skills, with the ability to perform trade-off analysis and evaluate multiple design options efficiently
Strong cross-functional and customer communication skills, with fluency in English required; Mandarin proficiency preferred
Familiarity with Product Data Management (PDM) systems such as Windchill and experience with Agile Development processes

Preferred

Ph.D. in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering
Familiarity with rack server design specifications and data center operational requirements
Experience in developing products for hyperscale data centers
Deep knowledge of industry thermal standards, such as ASHRAE TC 9.9

Company

Foxconn Industrial Internet

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Foxconn Industrial Internet is a manufacturer and seller of communication network equipment. It is a sub-organization of Foxconn Technology Group.

H1B Sponsorship

Foxconn Industrial Internet has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (5)
2023 (2)
2022 (9)
2021 (5)
2020 (2)

Funding

Current Stage
Public Company
Total Funding
unknown
2018-06-08IPO

Leadership Team

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Chien Min Wang
Director Board Of Directors
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Company data provided by crunchbase