Foxconn Industrial Internet - FII · 9 hours ago
Thermal Engineer
Houston, TX
Full-time
Onsite
Senior Level
5+ years expFoxconn Industrial Internet - FII is seeking a highly skilled Thermal Engineer specializing in thermal management design for server and rack products. The role involves developing thermal solutions from concept to mass production, ensuring product performance and reliability through advanced simulation and testing techniques.
Consumer Electronics
Responsibilities
Lead thermal management design for server and rack systems, including chip, board, system, and rack-level thermal solutions
Conduct thermal simulation and optimization using advanced tools such as FloTherm, Icepak, and Ansys CFD
Plan and execute thermal tests, including operating environmental chambers to validate design performance and reliability
Analyze and optimize airflow management systems and design efficient cooling solutions, such as liquid cooling or hybrid cooling technologies
Collaborate with cross-functional teams (mechanical design, electrical design, and manufacturing) and customers to ensure designs meet thermal performance, production requirements, and client-specific needs
Actively participate in customer technical review meetings, provide design recommendations, and resolve technical issues promptly
Build strong client relationships by working closely with customers to refine technical solutions and ensure alignment with their expectations
Review and evaluate new technologies and materials to ensure thermal design meets industry trends and future needs
Prepare detailed test reports and technical documentation to support internal and customer design reviews
Work closely with Taipei and other global R&D centers, requiring strong communication skills in English and Mandarin
Qualification
Required
Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or Aerospace Engineering. A Ph.D. is a plus
At least 5 years of experience in thermal design for servers and racks, with familiarity with cloud computing and data center requirements
Deep understanding of thermodynamics, heat transfer, and fluid dynamics, with practical application in design and testing
Expertise in thermal simulation tools (e.g., FloTherm, Icepak, Ansys CFD) and 3D/2D CAD tools (e.g., PTC Creo, SolidWorks, UG NX)
Hands-on experience with server thermal testing equipment, including environmental chambers and airflow measurement devices
Ability to develop and optimize liquid cooling solutions and a strong understanding of hybrid cooling technologies
Familiarity with fan module design and airflow control techniques
Excellent analytical and problem-solving skills, with the ability to perform trade-off analysis and evaluate multiple design options efficiently
Strong cross-functional and customer communication skills, with fluency in English required; Mandarin proficiency preferred
Familiarity with Product Data Management (PDM) systems such as Windchill and experience with Agile Development processes
Preferred
Familiarity with rack server design specifications and data center operational requirements
Experience in developing products for hyperscale data centers is highly desirable
Deep knowledge of industry thermal standards, such as ASHRAE TC 9.9, and the ability to apply them in product design
Company
Foxconn Industrial Internet - FII
Hon Hai Precision Industry Co., Ltd., widely known as Foxconn, is a Taiwanese multinational electronics manufacturer and one of the world’s largest contract manufacturers.
501-1000 employees
Funding
Current Stage
Late StageCompany data provided by crunchbase