Physical Design and Methodology Lead jobs in United States
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Google · 7 hours ago

Physical Design and Methodology Lead

Google is a leading technology company focused on AI and Infrastructure, and they are seeking a Physical Design and Methodology Lead. In this role, you will shape the future of AI/ML hardware acceleration by driving TPU technology, contributing to the innovation behind products used by millions worldwide, and leading efforts in physical design methodologies and automation.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Lead the effort for timing closure of blocks, subsystems, and fullchip
Drive physical implementation steps including synthesis, floorplanning, place and route, power/clock distribution, congestion analysis, timing closure, CDC analysis and formal verification on blocks, subsystems or fullchip
Work with logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure
Drive physical design methodologies and automation scripts for various implementation steps
Perform technical evaluations of vendors, process nodes, IP, and provide recommendations

Qualification

Physical design flowEDA toolsPython scriptingTcl scriptingFull-chip designBlock-level designSign-off closure techniquesLow-power implementationHigh-speed IP integrationMaster's degreePhD degreeSoft skills

Required

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
8 years of experience with physical design flow and methodologies
Experience with EDA tools for physical design
Experience in full-chip or block-level physical design
Experience with scripting in Python, Tcl, or Perl

Preferred

Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture
Experience developing and deploying methodologies and Tcl/Python automation to significantly boost Time-to-Market (TTM) and Quality of Results (QoR)
Experience in sign-off closure techniques, including SSTA, physical verification, EMIR, and low-power implementation (UPF/CPF)
Experience in integrating and ensuring closure for high-speed IP subsystems
Experience with evaluating foundry process nodes, third-party IP, and vendor capabilities to inform long-term strategic decisions and planning

Benefits

Bonus
Equity
Benefits

Company

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
2021 (9109)
2020 (9785)

Funding

Current Stage
Public Company
Total Funding
$26.1M
Key Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M

Leadership Team

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Sundar Pichai
CEO
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Thomas Kurian
CEO - Google Cloud
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Company data provided by crunchbase