Principal Design Engineer, NVEG jobs in United States
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Micron Technology · 15 hours ago

Principal Design Engineer, NVEG

Micron Technology is a world leader in innovating memory and storage solutions. The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Manage major IO/datapath block(e.g. input receiver, serializer, deserializer, clock distribution, equalizer, ZQ calibration, ONFI training features, wave pipeline) to meet specifications and verify functionality and performance
Model parasitics on layout and optimize signal quality by layout optimization. Review layout regularly and find opportunities of improving area/power
Communicate with project integration and other functional teams in design on specifications of major block interfaces
Communicate with PE to drive silicon experiments and propose and implement fixes for yield improvement and silicon debugging
Communicate with Apps regarding introduction of new specs and limitations based on design requirements and limitations
Document and review final results with experts and stakeholders

Qualification

Physical design flowsHigh-speed IO circuit performanceChip architectureAI design optimizationDRAM interface experiencePower delivery network designCommunication skillsProject management

Required

BS or MS in Electrical Engineering with 8+ years of relevant experience
Experience in physical design flows and optimization, top-level IO blocks floorplan, and high-speed interfaces for NAND and training features
Advanced knowledge and understanding of high-speed IO circuit performance, power and area optimization, and chip architecture/floorplan
Experience with managing complex design projects, effectively communicating progress and outcomes

Preferred

Hands-on experience in utilizing AI to improve quality of design and efficiency
Experience in DRAM interface (e.g. DDR4/5, LPDDR5/6, HBM3/3E/4) as well as other industry standard interfaces
Experience in chip level PDN optimization, signal/power integrity, power delivery network design, and physical design
Comprehensive understanding of CMOS BSIM model, CMOS targets for high speed IO operation, and CMOS device reliability

Benefits

A choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
A robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase