Air Force Research Laboratory · 14 hours ago
Senior Microelectronics Design Engineer
Air Force Research Laboratory is seeking a motivated and experienced Senior Microelectronics Design Engineer to join their Advance Packaging Section. The role involves leading digital engineering methodologies, digital IC design, and ensuring microelectronics assurance to support mission-critical research.
Military
Responsibilities
Lead Digital engineering/twin methodologies in support of Program of Records
Lead Digital IC design, ASIC, FPGA, microelectronics assurance in support of mission-critical research
Knowledge of problems and solutions associated with modern hardware security and trust
Applies expert knowledge and advanced engineering methods, theories, concepts, principles and processes to support the mission of proving options for programs to implement various levels of trust and assurance into their systems
Oversees in-house and contractual programs ranging from basic research and exploratory development of advanced component demonstration efforts
Builds coalitions and interacts internally and externally to foster collaborations, customer interactions and an environment of technology exploitation
Actively engages organizational planning activities within the Branch, Sensors Directorate, Air Force, DoD, and other governmental agencies and provides input into future requirements and roadmaps
Acts as a senior representative, technical and programmatic focal point to customers and partners on all assigned program-related activities
Plans and manages both unclassified and classified research and development
Qualification
Required
US Citizenship
Must be able to obtain/maintain a Top Secret clearance with access to SCI and SAP clearance as condition of employment
This is a drug testing designated position. The incumbent will be subject to random testing
Applicants must have at least one (1) year of specialized experience at the next lower grade, DR-02 or equivalent in other pay systems. Specialized experience includes digital IC design, ASIC/FPGA development, and microelectronics assurance to proactively identify and mitigate vulnerabilities; applying advanced digital engineering techniques to lead the future of R&D in DoD platforms; and program management on DAF R&D efforts
Applicants must be able to meet the OPM Qualification Standards of the position being filled. Positions will be filled using the following OPM occupational series: All Professional Engineering Series (0855): https://www.opm.gov/policy-data-oversight/classification-qualifications/general-schedule-qualification-standards/0800/files/all-professional-engineering-positions-0800.pdf
Possess a professional science or engineering (S&E) degree in a relevant technical field, from an accredited (or ABET accredited for engineering) academic institution
This position is an Acquisition Professional Development Program (APDP) position requiring Tier 2 (Practitioner) Non-Critical certification in Engineering and Technical Management (N). Selectee will have 5 years to complete certification requirements and must have 4 years of experience to become fully certified
Selectee is required to submit annual Confidential Financial Disclosure (OGE Form 450)
Preferred
Experience with executable test plans and coverage-driven verification
Experience with IP license agreements, DIB partnerships, and government contract management
Experience in digital engineering/twin, microelectronics verification, and assurance methodologies
PhD in Electrical Engineering or related field
Strong project management skills with experience tracking and managing cost, schedule, and performance
Extensive experience planning, budgeting, developing, and executing research and advanced development efforts
Strong communication and interpersonal skills to engage with program managers and senior leaders
Company
Air Force Research Laboratory
Air Force Research leads the discovery, development and delivery of warfighting technologies for our air, space and cyberspace forces.
Funding
Current Stage
Late StageRecent News
Business Wire
2026-01-09
2026-01-07
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