Apple · 11 hours ago
Process Engineer
San Francisco, CA
Full-time
Onsite
Senior Level
$181K/yr - $318K/yrApple's ATG Sensing Group is looking for a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. The role involves owning process development for New Product Introduction and collaborating with internal and external teams to solve complex integration challenges.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Ownership of process equipment definition, process material selection, and process flow design for module packaging
Own existing projects packaging process and materials. Evaluate process and materials impact of module packaging with system integration
Develop new package process concepts to realize new module designs base on unique system requirements. Develop new package processes from Proof-of-Concept demonstrations to full production implementation
Collaborate with reliability team and product design team to identify design and process issues with the use of FMEA
Deep integration of simulations to validate design impact of process ahead of initiating process development
Establish communication channels with module integrators and any key technical suppliers to accomplish project success
Consolidate Major Issues List for each project to communicate with both internal and external parties
Collaborate with program management teams to accomplish timely delivery of project
Hand-off projects from engineering phase to operations team with clearly defined goals and deliverables
Present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings
Have passion in semiconductor packaging technology, self motivated, can go deep, and be able to deliver under minimal supervision
Leveraging AI to improve overall project efficiency
Qualification
Required
Proven track record of shipping products
Deep technical expertise in assembly processes
Strong leadership skills
Experience in a high volume manufacturing environment
Ability to lead cross functional teams to success
Experience operating independently as well as collaboratively in a complex multi-disciplinary development program
Ownership of process equipment definition, process material selection, and process flow design for module packaging
Evaluate process and materials impact of module packaging with system integration
Develop new package process concepts to realize new module designs based on unique system requirements
Develop new package processes from Proof-of-Concept demonstrations to full production implementation
Collaborate with reliability team and product design team to identify design and process issues with the use of FMEA
Deep integration of simulations to validate design impact of process ahead of initiating process development
Establish communication channels with module integrators and any key technical suppliers to accomplish project success
Consolidate Major Issues List for each project to communicate with both internal and external parties
Collaborate with program management teams to accomplish timely delivery of project
Hand-off projects from engineering phase to operations team with clearly defined goals and deliverables
Present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings
Passion in semiconductor packaging technology
Self motivated, can go deep, and be able to deliver under minimal supervision
Leveraging AI to improve overall project efficiency
Preferred
Understand and keep up-to-date with industry landscape on relevant technologies
Strong interpersonal and team-building skills
Proven track record of work with OSAT to bring up a product from conceptual to MP stage
Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging interactions and reliability failures
Proficient in applying DOE vs. Hypothesis tool for root cause analysis
Excellent written and verbal communication skills
In-depth knowledge in the area of semiconductor sensor packaging technologies
Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes
Working level knowledge in wafer bumping, RDL, and TSV
Experience in using simulation to guide process setup
Experience in using AI to support process development
Experience in capacitive sensing module packaging
Experience in customer facing cosmetic packaging
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
Founded in 1976
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Public CompanyTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
2021-04-30Post Ipo Equity
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
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2025-09-25
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