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Qnity · 20 hours ago

Scientist - Advanced Packaging Metallization

Marlborough, MA

Full-time

Onsite

Senior Level

$79K/yr - $124K/yr

5+ years exp

Qnity is a global leader in materials and solutions for advanced electronics and high-tech industries, seeking a highly motivated scientist to join their Advanced Packaging New Product Development team. The role focuses on designing and optimizing electroplating formulations for Copper, Solder, and Nickel applications in next-generation semiconductor packaging technologies.

AerospaceAutomotiveConsumer ElectronicsHealth CareTelecommunications

Responsibilities

Design and develop electroplating chemistries for Cu, solder, and Ni applications in advanced packaging

Optimize additives, grain refiners, and stabilizers to achieve target properties (e.g., uniformity, low defectivity, controlled grain structure)

Ensure compatibility with high-aspect-ratio TSVs, microbump Cu/Ni/SnAg, and hybrid bonding requirements

Collaborate with process engineers to integrate formulations into plating tools and manufacturing workflows

Support scale-up from lab to pilot and high-volume manufacturing

Perform electrochemical analysis (CV, Chronopotentiometry, Chronoamperometry, LSV, etc) and surface characterization (SEM, EBSD, XRD)

Evaluate mechanical, electrical, and reliability performance of plated layers

Work closely with customers to align formulation performance with device requirements

Partner with plating tool OEMs to qualify chemistries and optimize process windows

Identify opportunities for novel formulations and file patents to protect intellectual property

Stay current with industry trends in advanced packaging and electroplating technologies

Qualification

Electroplating chemistry developmentCuSolderNi platingElectrochemical characterizationGrain engineeringSurface chemistryReliability testingAnalytical skillsAdvanced packaging technologiesProblem-solving skillsCommunication skillsCollaboration abilities