Amazon · 9 hours ago
Sr. Thermal & Mechanical Engineer, Annapurna Labs
Austin, Texas, USA
Full-time
Onsite
Senior Level, Lead/Staff
$159K/yr - $215K/yr
10+ years expAnnapurna Labs, a part of Amazon, is focused on designing silicon and software that accelerate innovation in cloud solutions. The role involves designing and optimizing hardware in data centers, leading the application of new technologies to enhance customer experience and performance.
Artificial Intelligence (AI)DeliveryE-CommerceFoundational AIRetail
Responsibilities
As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure
You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing
Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users
Qualification
Required
BS or MS degree in Mechanical/Thermal Engineering
10+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
Preferred
Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
Working knowledge on fans, valves, chillers, and CDUs
Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
Develop detailed CFD and compact RC models for SoC and Package thermal analysis
Knowledge of hardware and software based thermal / power management control algorithms
Optimize thermal solutions under PPA and system design constraints
Simulate and prototype thermal control strategies
Validate thermal models through power/thermal measurements on Hardware
Benefits
Health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
401(k) matching
Paid time off
Parental leave
Company
Amazon
Amazon is a tech firm with a focus on e-commerce, cloud computing, digital streaming, and artificial intelligence.
10001+ employees
H1B Sponsorship
Amazon has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (22803)
2024 (21175)
2023 (19057)
2022 (24088)
2021 (12233)
2020 (14881)
Funding
Current Stage
Public CompanyTotal Funding
$8.11BKey Investors
AmazonKleiner Perkins
2023-01-03Post Ipo Debt· $8B
2001-07-24Post Ipo Equity· $100M
1997-05-15IPO
Leadership Team
Douglas J. Herrington
CEO, Worldwide Amazon Stores
Werner Vogels
VP & CTO
Recent News
TechRadar.com
2026-01-16
2026-01-16
Chicago Sun-Times - Business
2026-01-16
Company data provided by crunchbase